Other

Tdk Corporation

Nof Corporation

Yoshiyuki Yasukawa

Kenji Endou

Toshiaki Yamada

Michihisa Yamada

Yasuo Moriya

Takeshi Takahashi

Hiroaki Hasegawa

Shigeru Asami

Tetsuya Itoh

Tadao Fujii

Tomiho Yamada

Tetsuya Ito

The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.

Heat resistant, low dielectric polymers, and films, substrates, electronic parts and heat resistant resin molded parts using the same

The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.

Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom

A delay line component having merits of small physical size and small insertion loss in a radio frequency. The delay line component with coaxial cable structure includes a center conductor, a dielectric which surrounds the center conductor and an outer conductor which is formed outside the dielectric. The dielectric is made of a ceramic dielectric with a large dielectric constant.

Delay compensation device, delay line component and manufacturing method of the delay line component

Growing community of inventors

Chiba, Japan

Yoshiyuki Yasukawa