Taiyo Yuden Co., Ltd.

Yoshiyuki Wasada

Tetsuya Ito

Naoki Tomaru

Hideki Kato

Hitoshi Ebihara

Tomohiro Igarashi

Hideki Yoda

Mitsuaki Ootani

Yuji Ebinuma

Takeshi Nakayama

Takayuki Tsukamoto

Yasuo Hosaka

Nobuyuki Yamazaki

Yasushi Inoue

Junichi Shimamura

Kiichi Kikuchi

Kenji Kaneta

Hajime Hasegawa

Hybrid integrated circuit device

Hybrid integrated circuit board

Hybird integrated circuit board

The present invention provides a switching circuit and an electronic switching component having a switching semiconductor device to perform switching between a conducting state and a non-conducting state of a conducting path to thereby reduce the power loss thereof and a control method thereof. In the present invention, at least two FETs and wherein the FET has a faster switching time and the FET has a lower ON resistance. Active terminals (drains and sources) of the FETs and are connected to each other in parallel. By employing these FETs and the conversion between an ON-state and an OFF-state of the conducting path is performed. In converting from the non-conducting state to the conducting state, the control circuit first turns on the FET and then turns on the FET when if a voltage between terminals of the FET reaches around a saturation value thereof. In converting from the conducting state to the non-conducting state, the control circuit first turns off the FET and then turns off the FET when if a voltage between terminals of the FET reaches around a saturation value thereof.

Switching circuit having a switching semiconductor device and control method thereof

A hybrid integrated circuit device is provided which suppresses lowering of the inductance value of a mounted coil component. A hybrid integrated circuit device according to the present invention has such a structure that a wiring pattern is provided on at least one main face of a substrate, a laid core type coil component is mounted on at least one main surface of the substrate, and a conductor pattern including a ground pattern is provided at least either on a main face opposite to the surface of the substrate upon which the laid core type coil component is mounted or in an interior of the substrate. In particular, the hybrid integrated circuit device has a configuration such that a magnetic flux passing window, having an absence of ground pattern, is provided in an orthographic projection area corresponding to a winding portion of the coil component in the conductor pattern.

Growing community of inventors

Tokyo, Japan

Yoshiyuki Wasada