Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Matshushita Electric Industrial Co., Ltd.

Yoshiyuki Wada

Tadahiko Sakai

Shoji Sakemi

Koji Motomura

Hideki Eifuku

Mitsuru Ozono

Seiichi Yoshinaga

Satoshi Yamaguchi

Shogo Okita

Takashi Hashimoto

Tokuzo Kiyohara

Hideshi Nishida

Kozo Kimura

Toshihiro Wada

Makoto Hirai

Kosuke Yoshioka

Takeshi Furuta

Toshiyuki Takasaki

Tsubasa Saeki

Naoaki Takeda

Yuya Shigenobu

Takahiro Miyai

Toshio Nishi

Yukiharu Ieda

Eigo Kadokami

Disclosed is a plasma processing apparatusincluding a chamber, a stage, a dielectric member, a cover, a gas introduction path, and an induction coil. The induction coilincludes a first induction coilinstalled so as to overlap a central region Rof the dielectric member, and a second induction coilinstalled so as to overlap a peripheral region Routside the central region Rof the dielectric member. The coverhas a first gas holeformed at a position overlapping the central region Rand a second gas holeformed at a position overlapping the peripheral region R. The gas introduction pathhas a first gas introduction pathcommunicating with the first gas holeand a second gas introduction pathcommunicating with the second gas hole

Plasma processing apparatus and method for using plasma processing apparatus

An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.

Electronic component mounting method

Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.

Electronic component-mounted structure, IC card and COF package

An image decoding apparatus includes a plurality of decoders and (i) divides image data to decode into a plurality of pieces of partial data, (ii) acquires attribute information pieces each affecting decoding processing time of a corresponding one of the plurality of pieces of partial data, (iii) determines which of the plurality of decoders is caused to decode which of the plurality of pieces of partial data based on the attribute information pieces on the plurality of pieces of partial data and (iv) causes two or more of the plurality of decoders to decode two or more corresponding pieces of the partial data in parallel.

Image decoding device

The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four corners of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.

Electronic component mounting structure

A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.

Component built-in circuit substrate and method of producing the same

A wiring board with a built-in component includes an insulating board, a first wiring pattern on an upper surface of the insulating board, plural electrodes on the upper surface of the insulating board, a solder resist on the upper surface of the insulating board, plural solders on the electrodes, respectively, an electronic component joined to the electrodes with the solders, a sealing resin provided between the insulating board and the electronic component, a component-fixing layer provided on the upper surface of the insulating board and the first wiring pattern and having an insulating property, a second wiring pattern on the component-fixing layer, and an interlayer wiring connecting the first wiring pattern to the second wiring pattern. The solder resist surrounds the electrodes. The sealing resin entirely covers the solders and the solder resist. This wiring board can be efficiently manufactured by simple processes.

Wiring board with built-in component and method for manufacturing wiring board with built-in component

To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. In a construction in which by using a solder paste containing solder particlesin a thermosetting resin, a rigid substrateand a flexible substrateare bonded by the thermosetting resin, and a first terminaland a second terminalare electrically connected by the solder particles, a blending ratio of an activator of the thermosetting resinin the solder paste is properly set and oxide film removed portions, andare partially formed in oxide films, andof the first terminal, the second terminal, and the solder particles. Thereby, the first terminaland the second terminalare electrically conducted by solder bonding the solder particlesto both the first terminaland the second terminalvia the oxide film removed portionsand, and while fusion of the solder particleswith each other is prevented in the thermosetting resin, connection of components at a low electrical resistance is realized with high reliability.

Components joining method and components joining structure

In order to mount an electronic component, a connection terminal of the electronic component is bonded to electrodes of a substrate. This is done by using solder paste which mixes solder particles in a thermosetting adhesive. The solder paste is supplied to the electrodes and a recess. Solder print parts are formed. The electronic component is mounted and the connection terminal and the main body of the electronic component are adhered to the solder print parts, and are heated in this state by reflow. As a result, the connection terminal and the electrodes are bonded by a solder junction.

Electronic component mounting method and electronic component mounting device

A variable length code decoding apparatus according to the present invention includes: an extracting unit which extracts a bit string from a beginning of a bit stream; a first storage unit for storing a plurality of code words in which one piece of data has been coded, and decoded data and code lengths respectively corresponding to the code words; a second storage unit for storing a plurality of code words in which two or more pieces of data have been coded, and decoded data and code lengths respectively corresponding to the code words; a first judging unit which judges whether one of the code words stored in the first storage unit is included in the extracted bit string, and, when judged as being included, outputs the decoded data and the code length of the code word; and a second judging unit which judges whether a code word stored in the second storage unit is included in the extracted bit string, and when judged as being included, outputs the decoded data and the code length of the code word, wherein the extracting unit extracts the bit string to be decoded next in the same cycle as a cycle in which the judgment was made by the first judging unit, and extracts the bit string to be decoded next in a cycle following the cycle in which the judgment was made by the second judging unit.

Variable length code decoding apparatus and method with variation in timing of extracting bit string to be decoded depending on code word

In a semiconductor device provided with a thinned semiconductor element, the present invention intends to inhibit damage of the semiconductor element in the neighborhood of its outer periphery so as to improve reliability. A plurality of external connection terminals are formed on a front surface of the thinned semiconductor element. A plate higher in rigidity than the semiconductor element is adhered with a resin binder to a rear surface of the semiconductor element. An outer shape of the plate is made larger than that of the semiconductor element, and the resin binder covers a side face of the semiconductor element to form a reinforcement portion for reinforcing a periphery of the semiconductor element.

Semiconductor device and method for assembling the same

The present invention provides an image decoding apparatus that realizes speed-up processing of taking out an MR (macroblock remainder) from a fixed length unit that consists of a first DCT block and the MR, without increasing cost. A Setup processoroutputs one out of a plurality of fixed length units that constitute an SB (synchronized block). First, calculation is performed for a length from a beginning of the fixed length unit to a EOB (end of block) that is included in the fixed length unit. The calculated length is then used as an offset in taking out the MR. Then an end portion of a second DCT block that is included in the MR is combined with a corresponding beginning portion of the second DCT block, in order to obtain the complete second DCT block. The complete second DCT block is outputted to a variable length code decoder

Image decoding apparatus, recording medium which computer can read from, and program which computer can read

In a semiconductor device of a structure comprising a thin semiconductor element bonded to a reinforcing plate via a bonding layer of a predetermined thickness, resin binder used for forming the bonding layer contains fillers including a first filler, which has a diameter generally equal to a target thickness of the bonding layer to be adjusted to a value within a range of proper thickness (from 25 &#x3bc;m to 200 &#x3bc;m). This can maintain the bonding layer within the range of proper thickness when the semiconductor element is bonded to the plate, and ensure on-board mounting reliability of the semiconductor device.

Semiconductor device and resin binder for assembling semiconductor device

A semiconductor device assembly and a semiconductor device are provided which both can ensure reliability after a mounting process. The semiconductor device includes a semiconductor element equipped with bumps on an electrode patterned surface thereof for external connection. In the semiconductor device mounted on a substrate in the semiconductor device assembly, a semiconductor element shaped to have a thickness ranging from 200 &mgr;m to 10 &mgr;m has reduced flexural rigidity so as to be easily deflected. In the status that the bumps are joined to corresponding circuitry electrodes on the substrate, the semiconductor element can deflect at other portions other than its surface between two adjacent bumps according to contraction and distortion of the substrate. This allows the bumps to be dislocated in a direction parallel to a surface of the semiconductor element, hence relieving stress developed by the contraction of the substrate at the joint positions between the bumps and the circuitry electrodes.

Growing community of inventors

Fukuoka, Japan

Yoshiyuki Wada