Canon Kabushiki Kaisha

Yoshiyuki Usui

Shinichi Hirano

Nozomu Hayashi

Takamitsu Komaki

An imprint apparatus for forming a pattern on an imprinting material includes an alignment unit that detects a mold-side mark formed on a mold and a substrate-side mark formed on the substrate, forming a mark pair, and aligns the mold and the substrate on the basis of a detection result. The alignment unit obtains, by using the detection result of a first mark pair and the detection result of a second mark pair, which is different from the first mark pair, positional deviation information of the first mark pair and positional deviation information of the second mark pair in the same direction; obtains a determination value by using the positional deviation information of the first mark pair and the positional deviation information of second mark pair; and determines that mark detection is abnormal when the determination value is not in an allowable range.

Imprint apparatus and article manufacturing method

An imprint method includes: before contacting a mold with an imprint material on a target shot region, obtaining relative position of the target shot region with respect to the mold, and performing first alignment between the target shot region and the mold by driving a correction unit configured to correct the relative position of the target shot region; after contacting the mold with the imprint material on the target shot region, performing second alignment between the target shot region and the mold by driving the correction unit; and performing the imprint process on the target shot region after the second alignment. The first alignment includes alignment performed based on a driving amount of the correction unit in the second alignment for another shot region where the imprint process has been performed earlier than in the target shot region.

Imprint method, imprint apparatus, and article manufacturing method

The present invention provides an imprint apparatus which forms a pattern in an imprint material on a substrate using a mold, the apparatus including a stage configured to hold the substrate, a holding mechanism configured to hold the mold, a scope configured to detect a mark provided on the mold, a driving mechanism configured to drive the scope to locate the mark provided on the mold within a field of view of the scope, and a processing unit configured obtain a positional shift amount from a reference position of the mold held by the holding mechanism based on a driving amount of the scope required for positioning the scope, and perform alignment between the mold and the substrate based on the positional shift amount.

Imprint apparatus, alignment method, and method of manufacturing article

An apparatus which illuminates an original by an illumination optical system and projects a pattern of the original onto a substrate. The apparatus includes a measuring device configured to measure the light intensity distribution, a detector configured to detect a total light quantity on the pupil plane, and a controller configured to determine a light quantity, to be detected when a target light intensity distribution is formed on the pupil plane, as a target light quantity based on the measured light intensity distribution and the detected total light quantity, and to control the adjusting mechanism so that the detected total light quantity becomes the target light quantity. The illumination optical system includes an adjusting mechanism configured to adjust a light intensity distribution on a pupil plane of the projection optical system.

Exposure apparatus, method of controlling the same, and device manufacturing method

An exposure apparatus for exposing a substrate to radiant energy includes: a stage including a chuck, and configured to hold the substrate on the chuck with vacuum and to be moved; a recovery device configured to recover the substrate from the stage; a first detector configured to detect an error of holding of the substrate on the chuck; a measuring device configured to measure an amount of positional deviation of the substrate relative to the chuck; and a controller configured to cause the measuring device to measure the amount of positional deviation in a case where the first detector detects the error, and to control an operation of the stage such that the amount of positional deviation falls within a tolerance based on the measured amount.

Growing community of inventors

Utsunomiya, Japan

Yoshiyuki Usui