Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Yoshiyuki Tsuru

Shigeharu Arike

Akishi Nakaso

Teiichi Inada

Eiichi Shinada

Takayuki Suzuki

Itsuo Watanabe

Shin Takanezawa

Naoyuki Urasaki

Kazunori Yamamoto

Toshiro Okamura

Kazuhisa Otsuka

Takeshi Horiuchi

Shinjirou Miyashita

Takashi Sugiyama

Akira Nagai

Hiroshi Shimizu

Yuichi Satsu

Atsushi Takahashi

Toshio Miyamoto

Shigeru Takahashi

Kunio Miyazaki

Ryuji Watanabe

Naoki Fukutomi

Yasushi Shimada

Kazuhito Kobayashi

Michio Ohue

Daisuke Fujimoto

Kazuyoshi Kojima

Nobuyuki Ogawa

Osamu Watanabe

Tetsuya Okishima

Osamu Miura

Kenzo Takemura

Kouichi Tsuyama

Akinari Kida

Haruo Ogino

Fumio Suzuki

Yukio Ookoshi

Masao Kanno

Kiyoshi Yamanoi

Susumu Naoyuki

Tadashi Isono

Norio Okano

Yutaka Taniguchi

Koichi Tsuyama

Toyoki Ito

Masayoshi Ikeda

Yuuichi Shimayama

Yoshihiro Tamura

Kunio Kawaguchi

Masahiro Kawamura

Yasusi Simada

An optical circuit substrate having optical fiber placed and fixed in the form of a circuit on one side or on both sides of a substrate can be prepared with good efficiency by providing thereto an optical interconnection portion which makes an area for optical connection smaller and registration between an optical element and optical fiber easy.

Optical circuit board and method of manufacturing the same

A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.

Substrate for mounting semiconductor chips

In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.

Electronic component parts device

An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.

Circuit boards using heat resistant resin for adhesive layers

A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.

Multiple wire printed circuit board and process for making the same

A resin composition comprising (a) an epoxy resin having a number average molecular weight of 1200 or less, (b) a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, (c) a curing agent for the epoxy resin, and (d) a curing accelerator is easily chemically etched and suitable as an insulating adhesive for producing multilayer printed circuit boards.

Resin composition and its use in production of multilayer printed

A heat resistant resin composition comprising (a) a polyamide-imide resin and (b) a thermosetting resin component, said composition giving a cured product having a storage elastic modulus at 300.degree. C. of 30 MPa or more, provides an adhesive sheet showing excellent solder heat resistance.

Heat resistant resin composition and adhesive sheet using the same

A chip fuse comprising an organic resin-made insulating substrate, a pair of electrodes formed at terminals of said organic resin-made insulating substrate, current protecting element wiring portions and a current protecting element positioned between said pair of electrodes and housed in said organic resin-made insulating substrate, said current protecting element having a thickness of 3-8 .mu.m and being supported on an organic resin layer having a high tracking resistance, and at least one space being formed at least on the current protecting element side, does not cause ignition nor smoking and is excellent in clearing characteristics.

Chip fuse and process for production thereof

A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Process for producing multilayer printed circuit board for wire bonding

A multilayered printed circuit board is produced by (a) forming a resin layer on an inner circuit substrate and abrading it to expose the circuit conductors, (b) contacting a copper foil having a layer of insulating adhesive composed of an epoxy resin, a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, a curing agent and accelerator with the resin layer and exposed circuit conductors, (c) removing portions necessary for connection with the copper foil and insulating adhesive exposed to the holes by etching, (d) connecting the copper foil with circuits exposed to the holes and forming a surface circuit by processing the outer layer of the copper foil, and (e) repeating steps (a) to (d) to obtained a multilayered structure.

Multilayer printed circuit board with epoxy resin and carboxylated

In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.

Process for producing multilayer printed circuit board

A process for forming a multilayer printed wiring board comprising integrally laminating a plurality of insulating circuit boards having circuits formed on insulating substrates and interlaminar insulating layers sandwiched between adjacent insulating circuit boards, and forming via holes for making electrical connection between two or more layers of circuits. Where the difference between the glass transition point of an interlaminar insulating layer and that of the adjoining insulating substrate is not greater than 60.degree. C., proof against exfoliation due to heat history of the board and high reliability of insulation and through-hole connection is achieved. The interlaminar insulating layers desirably are B-staged and have a B-stage resin flow of less than 1%.

Multilayer printed wiring board

A multilayer printed wiring board comprising a plurality of interlaminar insulating layers, a plurality of insulating circuit boards having circuits formed on the insulating substrates, and via holes for making electrical connection between two or more layers of circuits, wherein the difference between the glass transition point of an interlaminar insulating layer and that of the adjoining insulating substrate is not greater than 60.degree. C., is proof against exfoliation due to heat history of the board and has high reliability of insulation and through-hole connection.

A composite of metal and an organic film having a high adhesiveness without deterioration of film quality is provided by exposing the surface of organic film to at least one of chemically reactive gas phase molecules and gas phase ions thereby forming functional groups on the surface of organic film, and forming a metallic film thereon through the functional groups.

Metal-organic macromolecular synthetic resin composite and process for

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Shimodate, Japan

Yoshiyuki Tsuru