Murata Manufacturing Co., Ltd.

Yoshiyuki Tonami

Yoshihiro Koshido

Yuji Sugiyama

Masahiko Kawaguchi

Michiaki Iha

Mitsunori Hatada

A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.

Method of wiring formation and method for manufacturing electronic components

A multilayer composite includes an insulating substrate and patterned conductive layers and insulating layers alternately laminated on the insulating substrate. In a laminating process, a correcting insulating layer is formed on a laminate when a predetermined number of layers are laminated or when a predetermined degree of warpage of the laminate is detected by monitoring. The correcting insulating layer has a different composition from that of the other insulating layers to correct the warpage of the laminate.

Multilayer composite and method for preparing the same

In the production of a high frequency circuit chip in which a wiring pattern is disposed on a substrate having a through-hole, a connecting electrode of the through-hole is formed by filling electrically conductive paste into a perforation and firing it, and the wiring pattern is formed by a lift-off method. Moreover, at least the surface of the substrate for the wiring pattern to be formed thereon is mirror-polished, and thereafter, the wiring pattern is formed on the mirror-polished surface by the lift-off method.

High frequency circuit chip and method of producing the same

A spiral coil pattern is formed on a substantially rectangular insulation substrate of an inductor by photolithography. In the coil pattern, the electrode width of a portion of the pattern provided in the vicinity of the right short side of the substrate so as to be substantially parallel to the short side is wider than the electrode width of the other portion of the pattern. The interelectrode spacing of a portion of the pattern is wider than the interelectrode spacing of the other portion of the pattern. When the inductance of the inductor is required to be reduced to make the inductance a desired inductance value, the electrode width of the portion of the coil pattern is made wider in the inner direction of the coil pattern than the original electrode width.

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Machida, Japan

Yoshiyuki Tonami