Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi Car Engineering Co., Ltd.

Other

Hitachi Astemo Ltd.

Yoshiyuki Sasada

Terumi Nakazawa

Keisuke Masuda

Shiro Oouchi

Ken Ohsumi

Shinya Sato

Masayuki Miki

Atsushi Miyazaki

Seikou Suzuki

Toshiyuki Aoki

Satoshi Yamazaki

Mirai Higuchi

Masanori Kubota

Atsushi Koshizaka

Kazuo Matsuura

Masaaki Fukuhara

Tadashi Isono

Shinichi Yamaguchi

Masaaki Ootake

Shiro Ouchi

Mamoru Ooba

Yamamoto Kenji

The present invention provides a stereo camera device with which it is possible to prevent the deformation of a housing caused by a warp or strain imposed on a cover and a difference in the rate of increase of the temperature of the housing and the cover, as well as to reduce the size of the housing and to cut down component counts and assembly man-hours. In the present invention, fixing of a substrate and a housing together and fixing of a cover and the housing together are performed in common, and the substrate and the cover are fixed to the housing at the same (common) fixing point, whereby a warp or strain imposed on the cover and a difference in the rate of increase of the temperature of the housing and the cover are absorbed by an elastic body that is used for floating/fixing and is provided for the purpose of cancelling a difference in the amount of contraction and expansion caused by a difference in the coefficient of linear expansion of the substrate and the housing.

Stereo camera device

Vehicle-mounted stereo camera

An imaging apparatus includes a first imaging element that receives light having passed through a first optical element and outputs an image which has a luminance value corresponding to intensity of the light and is processed as a reference image. A second imaging element receives light having passed through a second optical element and outputs an image which has a luminance value corresponding to intensity of the light and is processed as a reference image. A distance calculation device calculates a distance image on the basis of the reference image and the comparison image, and recognition device recognizes an object on the basis of the distance image calculated by the distance calculation apparatus, in which the optical elements or the imaging elements satisfy at least one of conditions in which transmittance of the first optical element is higher than transmittance of the second optical element.

Imaging apparatus

In order to obtain a low-cost stereo camera which can decrease the load of software-based calibration, a stereo camera is provided with a first vehicle-mounted camera which comprises a first lens unit and a first imaging element, and a second vehicle-mounted camera which comprises a second lens unit and a second imaging element. This stereo camera is characterized in that the first imaging element has a first sensitivity value recording unit in which sensitivity values of the first imaging element are recorded, and the second imaging element has a second sensitivity value recording unit in which sensitivity values of the second imaging element are recorded, wherein the sensitivity variation width between the sensitivity values of the first imaging element recorded in the first sensitivity value recording unit and the sensitivity values of the second imaging element recorded in the second sensitivity value recording unit is within a preset reference width.

Stereo camera

To provide a stereo camera device capable of maintaining performance and reliability, while realizing thickness reduction, provided are a first image pickup device, a first communication connection unit to output a first image captured with the first image pickup device, a first image pickup substrate where the first image pickup device and the first communication connection unit are provided, a second image pickup device, a second communication connection unit to output a second image captured with the second image pickup device, a second image pickup substrate where the second image pickup device and the second communication connection unit are provided, and a housing where the first image pickup substrate is provided at one end and the second image pickup substrate is provided at another end. In the first image pickup substrate, the first image pickup device and the first communication connection unit are provided in parallel with each other in a lengthwise direction of the housing. In the second image pickup substrate, the second image pickup device and the second communication connection unit are provided in parallel with each other in the lengthwise direction of the housing. The first image pickup substrate and the second image pickup substrate are symmetrically provided.

An object of the present invention is to provide a millimeter wave radar device and module that provides a hollow structure while assuring adequate moisture resistance. A multilayer substrate on which at least one millimeter wave MMIC is mounted and a cap for forming a hollow around the MMIC are joined together with an adhesive or other similar organic member to obtain a high-frequency characteristic. The resulting assembly is housed in a case and covered with a moisture resistance by a gelled organic resin. The nonairtight structure obtained in this manner permits the use of low-cost members and provides increased productivity.

Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof

In a high-frequency circuit having a substrate having a high-frequency transmission line and an dielectric resonator formed on said substrate so that said dielectric resonator and said high-frequency transmission line may be coupled electro-magnetically to each other, a hole part or a cavity part is formed at a part of said substrate and a dielectric resonator is embedded in said hole part or said cavity part. In the same object, a high-frequency circuit having a dielectric resonator is produced by the step for forming a high-frequency transmission line on a substrate, the step for forming a hole part or a cavity part on a part of the substrate, and the step for mounting a dielectric resonator in the hole par formed on the surface of the substrate.

Mounting structure of high-frequency semiconductor apparatus and its production method

To provide a filter cover which has little electromagnetic effect on a dielectric resonator and is able to lengthen the life of a press mold without impairing isolation between transmission and reception. A VCO comprising a dielectric resonator, a high-frequency oscillator, a base, a cover, in which the distance between the surface of the cover facing the dielectric resonator and the surface of the base facing the dielectric resonator is half or below of the effective wave length of the oscillator frequency, and the cover has periodic projections facing the dielectric resonator which are a quarter of effective wave length of the oscillator frequency, wherein the nearest distance between the surface of the dielectric resonator facing the cover and the surface of the cover facing the dielectric resonator is a quarter or over of the effective wave length of the oscillator frequency.

Radar apparatus

Mounting structure of high frequency semiconductor apparatus and its production method

A high frequency transmitter-receiver which can prevent an antenna pattern from being broken. A radar apparatus is provided with a high frequency antenna, a base plate and a module. The antenna is comprised of an organic substrate and a metal pattern formed on the organic substrate. The high frequency antenna is adhered to the base plate astride the module. Here, the gap between the base plate and the module where the antenna is adhered is configured to satisfy the expression (an amount of change in gap size with respect to a change in use temperature)&divide;(an original gap size)&lE;6%.

High frequency transmitter-receiver

A pressure sensor superior in pressure resistance and capable of covering from a low to high pressure range as a measuring range is to be provided. Plural pressure sensing sections for high and low pressures are formed on a silicon board, the pressure sensing sections each com ing an outer frame portion, a diaphragm portion, a strain gauge portion and an electrode portion. The silicon board side with the strain gauge portions formed thereon and an insulating substrate having electrode take-out portions are bonded together in such a manner that the strain gauge portions are hermetically sealed and that the electrode portions on the silicon board and the electrode take-out portions of the insulating substrate are electrically connected with each other, to constitute a pressure sensing unit. The pressure sensing unit, a low-melting glass and a stem are laminated together in such a manner that lead pins are electrically bonded by solder to the electrode portions of the silicon board through the electrode take-out portions of the insulating substrate. In this state, the low-melting glass is melted to bond the pressure sensing unit and the stem with each other.

Semiconductor type pressure sensor

Growing community of inventors

Hitachinaka, Japan

Yoshiyuki Sasada