Sharp Kabushiki Kaisha Corporation

Toyo Tire Rubber Co., Ltd.

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Kobata Gauge Mfg. Co., Ltd.

Kobata Gauge Manufacturing Co., Ltd.

Yoshiyuki Nakai

Kazuyuki Ogawa

Koichi Sumida

Tetsuo Shimomura

Tsuyoshi Kimura

Yohichi Shimazawa

Atsushi Kazuno

Takatoshi Yamada

Masahiko Nakamori

Iwao Kobata

Kenji Nakamura

Takeshi Fukuda

Takao Tagawa

Yasushi Adachi

Junji Hirose

Masahiro Watanabe

Takashi Nishimachi

Etsuzi Nukushina

Takao Yamanouchi

Masayuki Nakano

Hiroshi Tanaka

Akihiko Taniguchi

Masakiyo Okuda

Tomohisa Yoshie

Atsushi Narukawa

Tokiyuki Okano

Tatsuya Tanaka

Katsumi Nagata

Daisuke Toyoshima

Masanori Toyoda

Keiji Taniguchi

Kohsuke Harada

Takahiro Minami

Takeshi Murakami

Seiji Kawaji

Tomoki Tanaka

Satoshi Shimizu

Toshio Takehara

Hajime Shimoide

Seido Kawanaka

Tsuyoshi Takeno

Tuyoshi Takeno

Toru Adachi

Keiji Nakamura

Akihiko Iwasaki

Kazuo Maruta

Hisao Nakajima

Tatsushi Nakajima

Youichi Yamamoto

Data transmitter with solar cell and sensor

An IC unit includes a scale increment reading module that is configured to: detect, when an indicator in an instrument rotates, rotation of the indicator, and convert the rotation into rotation data; and an antenna that is configured to transmit the rotation data wirelessly from the IC tag unit to a reader. The instrument includes a scale plate, scale increments on the scale plate remain viewable when the IC tag unit is affixed to the instrument. The instrument includes a transparent cover plate, the IC tag unit is affixed to the transparent cover plate when the IC tag unit is affixed to an instrument. The IC tag unit is calibrated by rotating the IC tag unit until an indicating portion of the indicator overlaps a first pointer on the scale plate.

Method for calibrating instrument provided with IC tag unit

An IC tag unit, for an instrument, which allows an IC tag into and from which instrument information, calibration information, inspection information, and the like can be written and read to be mounted to an instrument without affecting the IC tag by a metal portion of an instrument body, hindering visibility of a scale of the instrument, and further causing degradation due to dust, raindrops, or the like, and an instrument with the IC tag, are provided. An IC taghaving an IC chipand an antenna, and mounting means configured to mount the IC tag to an instrument, are provided, and the instrument has scale increments and a pointer, and a transparent cover platethat covers the scale incrementsand the pointer. The mounting means includes: a first sheet disposed on an outer side surface of the instrument; a second sheet that is disposed on an inner side surface of the instrument and that sandwiches the IC tag; and an attachment layer that allows both the sheets attached to each other to be attached to the transparent cover plate. The IC tag is disposed between both the sheets so as not to overlap the scale incrementsand an indicator portionof the pointerin a viewing direction, and a developed plane of the antenna is arranged along both the sheets, when the IC tag is mounted to the transparent cover plate.

IC tag unit for instrument, and instrument with IC tag

A method for producing a laminated polishing pad, which is free from warpage and does not cause peeling between a polishing layer and a cushion layer during polishing, includes the steps of: laminating a hot-melt adhesive sheet to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided; heating the laminated hot-melt adhesive sheet to be melted or softened; laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate; cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and peeling the thermoplastic resin base material from the laminated polishing sheet.

Method for producing laminated polishing pad

A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

Polishing pad

A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property.

Polishing pad and method for producing same

A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

As provided with a first reading section and a second reading section for reading both surfaces of a document, an image reading apparatus respectively calculates gamma correction values in gamma correcting sections and correction factors in color correcting sections, and corrects colors of criteria images being read by the first reading section and the second reading section in accordance with sample data stored on a storing section in order to substantially match the colors of both criteria images. In addition, the image reading apparatus utilizes an distinctive color range common for the both surfaces which defines a color about a distinguishing pattern, in order to determine whether images of both surfaces contain the distinguishing pattern or not.

Image reading apparatus for determining whether a document contains a distinguishing pattern

A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) that includes a polymerized diisocyanate and a polyethylene glycol with a number average molecular weight of 200 to 1,000, and (3) a chain extender.

A printer control processing device manages a result of the image capturing of the symbol pattern indicating information based on which a print process is controlled. The printer control processing device includes: a recording/retrieving section for obtaining reference pattern data and pattern printing data from an information storage section; a matching level determining section for determining a matching level between reference pattern data and the result of the image capturing by an image capturing device of a symbol pattern printed based on the pattern printing data; and a pattern modifying section modifying the pattern printing data corresponding to a captured symbol pattern if the matching level determining section determines that the matching level is less than a predetermined threshold. Therefore, pattern printing data can be provided which results in a reliably identifiable symbol pattern in the result the image capturing by the image capturing device.

Managing device, print processing system, managing device control method, managing device control computer program and storage medium containing managing device control computer program

The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.

Polishing pad, method of producing the same and method of producing semiconductor device by using the same

When an image based on RGB image data accepted by the image processing section and the ICU is to be enlarged by the zoom process section of the ICU (or when specification of an area in an image is accepted by the operation section), the leak-preventing identification mark detecting section, the positional relation calculating section and the forgery-preventing identification mark detecting section respectively determine whether patterns respectively representing a leak-preventing identification mark and a forgery-preventing identification mark are included separately in the entire area of the image and in an area to be enlarged (or an area whose specification has been accepted) or not.

Image processing device and image forming device

A polishing pad has an excellent polishing rate and is superior in longevity without generating center slow. A method of manufacturing a semiconductor device with the polishing pad is also provided. The polishing pad has a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight.

A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4'-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan &#x3b4; peak temperature of 100&#xb0; C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4&#x2032;-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan &#x3b4; peak temperature of 40&#xb0; C. or less, and (3) 4,4&#x2032;-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.

Growing community of inventors

Osaka, Japan

Yoshiyuki Nakai