Adv Antest Corporation

Yoshiyuki Masuo

Yoshihito Kobayashi

Akihiko Ito

Tsuyoshi Yamashita

Hiroto Nakamura

Shin Nemoto

Hiroyuki Takahashi

Toshiyuki Kiyokawa

Kazuyuki Yamashita

A handler is configured by, separably and connectably, a plurality of types of handling modules of different throughputs and a plurality of types of test modules of different numbers of simultaneous measurements and/or test temperatures. Based on the maximum number of measurable pins of the tester outputting a test pattern and examining a response pattern, the number of terminals of the DUTs, and the test time, the throughput of the handling module and the number of simultaneous measurements and/or test temperature of the test module are selected and combined.

Electronic device test apparatus and method of configuring electronic device test apparatus

An IC tester which is capable of reducing the time required before completion of testing on all of ICs to be tested is provided. The depth (length in the Y-axis direction) of the constant temperature chamberand the exit chamberis expanded by a dimension corresponding approximately to one transverse width (length of the minor edge) of the rectangular test tray, and two generally parallel test tray transport paths or alternatively a widened test tray transport path broad enough to transport two test trays simultaneously with the two test trays juxtaposed in a direction transverse to the widened test tray transport path are provided in the section of test tray transport path extending from the soak chamberin the constant temperature chamberthrough the testing sectionin the constant temperature chamberto the exit chamberso that two test trays may be simultaneously transported along the two test tray transport paths or the widened test tray transport path.

Semiconductor device testing apparatus and a test tray for use in the testing apparatus

An IC tester which is capable of reducing the time required before completion of testing on all of ICs to be tested is provided. The depth (length in the Y-axis direction) of the constant temperature chamber and the exit chamber is expanded by a dimension corresponding approximately to one transverse width (length of the minor edge) of the rectangular test tray and two generally parallel test tray transport paths or alternatively a widened test tray transport path broad enough to transport two test trays simultaneously with the two test trays juxtaposed in a direction transverse to the widened test tray transport path are provided in the section of test tray transport path extending from the soak chamber in the constant temperature chamber through the testing section in the constant temperature chamber to the exit chamber so that two test trays may be simultaneously transported along the two test tray transport paths or the widened test tray transport path.

Tester for semiconductor devices and test tray used for the same

A pad air cylinder cylinder control valve vacuum generator feed valve break valve and pressure sensor are assembled together to form an IC pickup

IC pickup, IC carrier and IC testing apparatus using the same

A semiconductor device testing apparatus having a reduced transverse width and compact in size is provided. Adjacent to a constant temperature chamber containing therein a vertical transport means is located a test chamber which is in turn adjoined by a temperature-stress removing chamber likewise containing therein a vertical transport means, so that the constant temperature chamber and the test chamber are arranged transversely in a line, while the temperature-stress removing chamber is located in front of the test chamber when viewed in front view of the apparatus. Further, a loader section is located in front of the constant temperature chamber, and an unloader section is located above the temperature-stress removing chamber. With this arrangement, the transverse width of the testing apparatus may be reduced to about two test tray lengths.

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Gyoda, Japan

Yoshiyuki Masuo