Denso Corporation

Nippon Soken, Inc.

Toyota Jidosha Kabushiki Kaisha

Micronas Gmbh

Tdk-micronas Gmbh

Yoshiyuki Kono

Takamitsu Kubota

Akitoshi Mizutani

Tomoyuki Takiguchi

Koichiro Matsumoto

Takashi Hamaoka

Takehito Mizunuma

Hitomi Honda

Takashi Kawashima

Satoru Hiramoto

Toru Shimizu

Hirofumi Hagio

Seiji Nishimoto

Yoshinori Inuzuka

Tsutomu Nakamura

Tetsuya Hara

Tomokazu Kondo

Takasuke Ito

Hiroyuki Shintani

Kenji Takeda

Tetsuji Yamanaka

Takeshi Ito

Osamu Shimomura

Tatsuya Kitanaka

Tetsuya Aoki

Takuma Uchida

Tomohiro Ito

Hisataka Okado

Ninh Duc Hoang

Shinji Ikeda

Katsuya Torii

Tomohiro Itoh

Hiroki Shimada

Naoaki Kouno

Haruhiko Suzuki

Atsushi Tanaka

Reiner Bidenbach

Kimio Uchida

Tohru Shimizu

Toshihisa Ishihara

Hidekazu Watanabe

Kunio Tanaka

Tetsuma Takeda

Hans-Jörg Fink

Martin Bayer

Takuya Fukitsuke

Takeshi Itou

Camillo Pilla

Yukinobu Kajita

Kenji Tak Da

Toshiyuki Koumori

A rotation angle sensor includes a sensor integrated circuit attached to an attachment member. The attachment member includes a connecting terminal protruding upward from an attachment surface and a guide protruding upward from the attachment surface and positions, together with the connecting terminal, the sensor integrated circuit at an attachment position. The sensor integrated circuit includes a lead frame on which an electronic circuit is mounted and an exterior covering the electronic circuit. The lead frame includes a lead and an extending portion located in an outer periphery of the exterior. At least one of the lead and the extending portion has an elastic structure. The sensor integrated circuit is attached to the attachment member by an elastic force of the elastic structure that biases the extending portion against the guide and that joins the lead to the connecting terminal.

Rotation angle sensor and method for manufacturing rotation angle sensor

The present disclosure provides a position detection device including an IC package, a terminal line and a sensor housing. The IC package includes a magnetic detection element, a sealing portion sealing the magnetic detection element, and a lead line protruding from the sealing portion and electrically connected to the magnetic detection element. The lead line is fixed to the terminal line. The sensor housing is formed separately from the IC package and supports the terminal line.

Position detection device

A rotation angle detection device for detecting a rotation angle of a rotating body includes a magnet having poles arranged along a radial direction perpendicular to a rotation axis of the rotating body, the magnet being disposed to rotate together with the rotating body, a magnetic portion provided in a ring shape radially outward of the magnet, a plurality of gaps being formed in the magnetic portion at a plurality of locations along a circumferential direction, and a magnetic detection unit arranged in a particular gap of the plurality of gaps, the magnetic detection unit being configured to detect a tangential magnetic flux component in a tangential direction and a radial magnetic flux component in the radial direction of a magnetic field.

Rotation angle detection device

A rotation angle detection device for detecting a rotation angle of a rotating body includes a magnet disposed to rotate together with the rotating body, a magnetic portion provided in a ring shape radially outward of the magnet, a plurality of gaps being formed in the magnetic portion at a plurality of locations along a circumferential direction, and a magnetic detection unit arranged in a particular gap of the plurality of gaps. The magnetic detection unit is located at a detection position, a width of the particular gap in the tangential direction at the detection position is defined as a detection position gap width, a width of the particular gap in the tangential direction at a position radially outward of the detection position is defined as a tangential width, and the tangential width is narrower than the detection position gap width.

A position detecting device includes an IC package, a first terminal line, a ground terminal line, a power supply terminal line, a second terminal line, a bypass terminal line, motor terminal lines, and a connector portion. A bypass terminal line is positioned on an opposite side of the ground terminal line across the first terminal line or the second terminal line and is connected to a bypass portion of the ground terminal line which connects to the ground connection portion. In the connector portion, the motor terminal line, the bypass terminal line, the second terminal line, the power supply terminal line, and the first terminal line are placed in this order.

Position detecting device, and method of manufacturing position detecting device

An output terminal of a signal output device is connected through a branch path to a voltage dividing point in a main path, and transmits an output signal based on a voltage of the voltage dividing point to an outside. A signal generation circuit adjusts the voltage of the voltage dividing point and generates the output signal. A short circuit detection circuit detects a short circuit between the output terminal and another terminal when a current flowing in the branch path is greater than a predetermined short circuit detection threshold. A switching circuit switches a current carrying capacity or a configuration of the signal generation circuit to limit a short circuit current flowing in the branch path when the short circuit is detected. The short circuit current is set to a value equal to or greater than the short circuit detection threshold and less than a current upper limit value.

Signal output device

A communication apparatus operates with a supply voltage of a power and transmits a sensor value with a digital communication method using consecutive frames. In the communication apparatus, a data source unit is configured to generate a frame using a data of a sensor value processed by a signal processing unit. A switching unit is configured to perform a signal switching to permit a transmission circuit to perform a re-transmission of re-transmitting a signal including the sensor value stored in a memory in response to a restoration of the power after an instantaneous power interruption. A frame monitoring unit is configured to monitor a status of a frame transmission and determine a frame at the occurrence of the instantaneous power interruption. The sensor value to be re-transmitted is determined based on information of the frame determined by the frame monitoring unit at the occurrence of the instantaneous power interruption.

Communication apparatus

A magnetic field detection device includes an IC package, a terminal, a resin mold member. The IC package includes a magnetism detection element, a lead frame located on a first side of the magnetism detection element, and a resin member covering the magnetism detection element and the lead frame. The resin mold member includes a base portion and a head portion. The head portion includes a thickest portion. An outer wall surface of the thickest portion located on a second side of the magnetism detection element is a detection reference surface. An element corresponding surface that is an outer wall surface of the IC package located on the second side is exposed to an outside of resin mold member or covered with a detection side thin portion thinner than a thickness from the element corresponding surface to the detection side reference surface.

Magnetic field detection device

A terminal insert article includes a metal terminal, and a resin molded article in which the terminal is inserted. The molded article is formed by injection molding. When a position of the molded article into which molten resin is injected at time of the injection molding is referred to as a resin injection position, the resin injection position is formed in a projecting shape. The molded article includes a spherical surface part at an opposite position from the resin injection position. The spherical surface part has a spherical surface shape swollen out in a direction away from the resin injection position. A component that constitutes a rotation angle sensor, which detects a rotation angle of a rotatably-supported shaft, is inserted in the molded article.

Terminal insert article

The present disclosure provides a rotational angle detecting device. An IC substrate has a flat surface extending along a rotational axis of a throttle valve. Yokes forms, together with the magnets, a closed magnetic circuit. A first Hall element outputs a first signal according to the magnetic flux density in a first direction along the flat surface. A second Hall element outputs a second signal according to the magnetic flux density in a second direction intersecting the flat surface. The first and second Hall elements are positioned within a region that is surrounded by the magnets and the yoke and that is between an edge surface and an edge surface.

Position detecting device

A sensor of a position detecting device includes a sensor body, a magnetic detector, and at least one engagement protrusion that extends from a position in the vicinity of the magnetic detector. The engagement protrusion engages with an engagement hole disposed on a casing. An anti-rotation hole is disposed on the casing in a position spaced apart from the engagement hole. An anti-rotation pin is disposed on the sensor body, and engages with the anti-rotation hole to prevent the casing and the sensor body from rotating relatively to each other about the engagement hole. At least a part of the engagement protrusion is in contact with an inner wall of the engagement hole on a straight line L connecting a center of the magnetic detector and a center of the anti-rotation pin.

A sensor includes: an integrated circuit having a power supply lead, a ground lead and a signal lead; a power supply terminal connected to the power supply lead; a ground terminal connected to the ground lead; a first signal terminal connected to the signal lead; a second signal terminal connected to the first signal terminal; a filter member having one end connected to one of the terminals and another end connected to another one of the terminals; and a sealing body sealing the integrated circuit, the terminals and the filter member. A part of each terminal is exposed from the sealing body.

Sensor and method for producing same

A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

Method for manufacturing semiconductor devices

An ECU loads detected values of a rotation angle sensor and a pressure sensor which are mounted to an electric throttle, and executes an abnormal-sensor determination control to determine whether one of the rotation angle sensor and the pressure sensor is abnormal. Specifically, the ECU determines that one of the rotation angle sensor and the pressure sensor is abnormal, in a case where a state that a tendency of the actual opening angle detected by the rotation angle sensor does not match a tendency of the pressure detected by the downstream pressure sensor has continued for a period greater than or equal to a predetermined period. Therefore, since the pressure sensor can replace the rotation angle sensor used for detecting abnormality in a conventional technology, two rotation angle sensors can be reduced to one rotation angle sensor, and a cost is reduced.

Electronic throttle

The present disclosure provides an electronic device including a casing, a terminal, a substrate, an electric connector, and a conductive adhesive. The terminal is fixed to the casing. The substrate is attached to the casing at a position where at least a portion of the substrate faces the terminal. The electric connector is fixed to a circuit wiring formed in the substrate at a position where the substrate faces the terminal. The electric connector protrudes toward the terminal from the circuit wiring. The conductive adhesive electrically and mechanically connects the terminal to the electric connector.

Electronic device

Growing community of inventors

Obu, Japan

Yoshiyuki Kono