Nichia Corporation

Yoshiyuki Kageyama

Kimihiro Miyamoto

Takashi Tani

Fukutaro Saegusa

Naoki Harada

Takashi Matsumoto

Kenji Ozeki

A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.

Method of manufacturing light source device having a bonding layer with bumps and a bonding member

A light-emitting module includes a first substrate, a heat dissipation member, a second substrate, and a light-emitting element. The heat dissipation member is disposed on the first substrate. The second substrate is disposed on the heat dissipation member. The light-emitting element is disposed on a lower surface of the first substrate or an upper surface of the second substrate. The heat dissipation member includes a graphite member and a metal member. The graphite member has a first surface facing the first substrate and a second surface located opposite to the first surface. The graphite member has a first groove extending in a first direction in the first surface. The metal member includes a first internal metal member disposed in the first groove.

Light-emitting module, vehicle lamp, and heat dissipation member

A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au&#x2014;Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.

A light-emitting module includes a first mounting board having a first surface and a second surface opposite to the first surface. The first mounting board has a recess on the first surface, and the recess has a bottom surface. The first mounting board has an opening passing through the first mounting board from the bottom surface to the second surface. The light-emitting module further includes a second mounting board provided in the recess, a light-emitting element provided on the second mounting board and configured to emit light through the opening, and an elastic cushion provided between the first mounting board and the second mounting board. The light-emitting module also includes a connector. The connector and the opening sandwich a center of the first mounting board when viewed from a direction from the second surface to the first surface.

Light-emitting module

A light-emitting module includes a first mounting board which has a first surface, a second surface opposite to the first surface, and a recess on the first surface. An opening passes through the first mounting board from a bottom surface of the recess to the second surface. A second mounting board has a mounting surface and a light-emitting element surface opposite to the mounting surface and is provided in the recess such that the light-emitting element surface faces the bottom surface of the recess. A light-emitting element is provided on the light-emitting element surface and configured to emit light through the opening. An elastic cushion is provided between the bottom surface and the light-emitting element surface. The second mounting board projects from the first surface of the first mounting board when a force pressing the second mounting board toward the bottom surface of the recess is not applied.

Growing community of inventors

Tokushima, Japan

Yoshiyuki Kageyama