Kabushiki Kaisha Toshiba

Agc Inc.

Agc Glass Europe

Agc Flat Glass North America, Inc.

Agc Vidros Do Brasil Ltda.

Yoshiyuki Ikuma

Masatoshi Suzuki

Ryuta Sonoda

Tetsuya Hiramatsu

Takaya Ogawa

Kentaro Oka

Masaki Horie

Ryota Okuda

Yasushi Higashida

Satoru Inagaki

To provide an antenna set capable of forming a communication area which achieves a relatively high throughput. An antenna set comprising a group of antenna units transmitting streams by distributed MIMO,

Antenna set

A coaxial connector includes a base surface; a coaxial structure where a dielectric is between a central conductor and an outer conductor; and a protrusion protruding from the base surface. The central conductor includes a contact portion protruding from the base surface. In response to a substrate being inserted toward the base surface between the contact portion and the protrusion, the contact portion comes into contact with a conductor pattern formed on a surface of the substrate. The outer conductor includes a protruding conductor protruding from the base surface and not in contact with the substrate inserted between the contact portion and the protrusion.

Coaxial connector and substrate with coaxial connector

The present invention relates to a laminated body with electric conductor including a substrate; a functional layer having at least an adhesive layer; an electric conductor; and a protective material, wherein the substrate, the functional layer having at least the adhesive layer, the electric conductor, and the protective material are sequentially laminated in a thickness direction, and wherein a thickness of the functional layer is less than or equal to 0.300 mm.

Laminated body having a substrate with an electrical conductor thereon that associated with a functional layer

A high-frequency module according to an embodiment includes a first board, a first device, a second board, a metal core, and a casing. The first board is formed with an opening, and has a surface at a first side on which a transmission circuit transmitting microwaves is formed. The first device is disposed in the opening of the first board. The second substrate is disposed at a second side of the first board. The second substrate is formed with a control circuit for the first device, and has an opening at a location overlapping the first device. The metal core is disposed between the first board and the second board, and is in contact with the first device. The casing includes a connection connected with the metal core via an opening formed in the second board.

High-frequency module and microwave transceiver

Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity.

High-frequency semiconductor package and high-frequency semiconductor device

Provided are a high frequency attenuator to attenuate high frequency energy by a minute amount and a high frequency device using the high frequency attenuator. The attenuator includes a dielectric base, a ground conductor provided on a back surface of the base, a first and second strip conductors provided on a front surface of the base, and a resistor. The first and second strip conductors constitute first and second high frequency transmission lines respectively in conjunction with the ground conductor and the base. The first strip conductor has a first end portion, and the second strip conductor has a second end portion which forms a gap with the first end portion. The resistor is provided in the gap. The first end portion is inclined with respect to the first high frequency transmission line, and the second end portion is inclined with respect to the second high frequency transmission line.

High frequency attenuator and high frequency device using the same

A transmitting/receiving module includes a first amplifier for amplifying a transmission signal, a second amplifier for amplifying a receiving signal, and a low reflection limiter provided on an input side of said second amplifier. There may be further provided a radiator from which the transmitting signal is to be radiated into an air and to which the receiving signal is to be received, and a circulator having a first terminal, a second terminal and a third terminal, in which the transmitting signal is inputted to the first terminal, the receiving signal is received by the radiator connected to the second terminal, the third terminal is connected to the second amplifier, and the low reflection limiter is provided between the circulator and the second amplifier.

Low reflection limiter and transmitting/receiving module utilizing same

An antenna for linearly polarized wave is accommodated in a case in which a heat sink is provided. By rotating the case depending on the vertically polarized wave or the horizontally polarized wave, wireless communication or broadcasting using the vertically polarized wave or the horizontally polarized wave can be selectively realized with high precision.

Growing community of inventors

Tokyo, Japan

Yoshiyuki Ikuma