Sumitomo Electric Industries, Limited

Sumitomo Wiring Systems, Limited

Autonetworks Technologies, Limited

Yoshiyuki Hirose

Hiroki Hirai

Makoto Higashikozono

Akihisa Hosoe

Hideyuki Kuboki

Tomoharu Takeyama

Eiichi Kobayashi

Akihiro Nagafuchi

Yoshishige Takano

Yugaku Abe

Akira Fukui

Takatoshi Takikawa

Shinichi Yamagata

Makoto Imamura

Hirohiko Nakata

Hiroomi Hiramitsu

Hisashi Sawada

Tadashi Tomikawa

Katsuhito Yoshida

Hirohisa Saito

Koichi Sogabe

Hideaki Awata

Takehisa Yamamoto

Kazutaka Sasaki

Mitsuru Shimazu

Sadamu Ishidu

Noboru Uenishi

Yuka Kondo

Yasushi Itoh

A heat transfer device includes a bag and a working fluid. The bag includes a first sheet and a second sheet with edges that are sealed together. The working fluid is enclosed in the bag. The working fluid changes a phase thereof between gas and liquid. The bag includes a vaporizing portion in which the liquid-phase working fluid is vaporized and a condensing portion in which the gas-phase working fluid is condensed. The bag includes a two-phase flow channel in which liquid-gas two-phase slug flow including the liquid-phase working fluid and the gas-phase working fluid occurs from the vaporizing portion to the condensing portion. The two-phase flow channel is provided in an internal space of the bag.

Heat transfer device and energy storage module

A cooling member includes refrigerant, an absorbing member absorbing the refrigerant, an enclosing member including flexible sheet members, that are connected to each other and enclosing the refrigerant and the absorbing member in a sealed state, and a heat releasing section configured to receive heat from the enclosing member and release the heat to an outside.

Cooling member and power storage module

A power storage module includes: a plurality of power storage elements; a plurality of cooling members each of which has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant at an extension portion extending in a region not overlapping the power storage element; and a heat dissipation member that receives heat of the plurality of cooling members and dissipates the heat to an outside. The heat dissipation member has a spacer portion that is disposed between the adjacent extension portions of the plurality of cooling members and is configured to abut with the bulging portion.

Power storage module

A power storage module includes a cooling member that has a coolant and a sealing body hermetically sealing the coolant; a power storage element that is stacked on the cooling members; and a heat transfer plate that is stacked on the power storage elements with the cooling members therebetween. The sealing body is configured to form a bulging portion deformed by evaporation of the coolant in a region not overlapping the power storage element. The heat transfer plate has a folded portion with which the bulging portion is configured to abut.

Power storage module including a cooling member

A power storage module includes: a plurality of power storage elements; a plurality of cooling members each of which has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant at an extension portion extending in a region not overlapping the power storage element; and a heat transfer member that has a spacer portion disposed between the adjacent extension portions of the plurality of cooling members and configured to abut with the bulging portion.

Power storage device including cooling member with bulging portion caused by evaporation of coolant

A power storage module includes: a power storage element; a cooling member that is stacked on the power storage element and has a sealing body hermetically sealing a coolant and an absorption member disposed in the sealing body to absorb the coolant; and a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween. The heat transfer plate is provided with protrusion portions that protrude to the cooling member side.

Power storage module with cooling member

A power storage module includes: a power storage element; a cooling member that has a coolant and a sealing body hermetically sealing the coolant, is stacked on the power storage element, and is configured to form a bulging portion by deformation of the sealing body caused by evaporation of the coolant in a region not overlapping the power storage element; a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween; and an elastic member that abuts with the heat transfer plate and the bulging portion and is elastically deformable.

A cooling member includes a sealing member including a first sheet member and a second sheet member connected to each other in a liquid-tightly closed state, a refrigerant enclosed in the sealing member, and an absorbing member disposed in the sealing member and configured to absorb the refrigerant.

Cooling member and power storage module with same

An enclosing member including a sheet member connected in a liquid tight manner, refrigerant enclosed in the enclosing member, and an absorbing member arranged in the enclosing member and absorbing the refrigerant. The enclosing member includes a condensation section where the refrigerant that is in a gaseous state is condensed, and in the condensation section, the absorbing member is attached on at least a lower section of an inner surface of the enclosing member with respect to a vertical direction.

A conductive member includes an enclosure, a coolant, and a conductor. The enclosure includes a sheet and has liquid tightness. The coolant is enclosed in the enclosure. The conductor includes a cool section that is disposed in the enclosure and a projecting section that is liquid-tightly sealed with the sheet and projects from the enclosure.

Conductive member

A power storage module includes power storage elements and cooling members that are in contact with the power storage elements to transfer heat. The cooling member includes an enclosing member, refrigerant, and an absorbing member absorbing the refrigerant, and the enclosing member includes a first sheet member and a second sheet member that are connected in a liquid tight manner, and the refrigerant and the absorbing member are arranged within the enclosing member. The cooling member is arranged to be inclined with respect to a horizontal plane such that a section thereof being in contact with the power storage element to transfer heat is on a lower level.

To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m&#xd7;K or higher and a thermal expansion coefficient of 20&#xd7;10/&#xb0; C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al&#x2014;SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al&#x2014;SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600&#xb0; C. in a non-oxidizing atmosphere.

Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

To provide a heater module which can improve the temperature uniformity in an optical waveguide while keeping the power consumption and the thickness of the optical waveguide module. A heater module in accordance with the present invention is a heater module for heating an optical waveguide device so as to regulate its temperature; and comprises a heat-generating circuit adapted to generate heat when energized, and a heat-transmitting section disposed on the upper face of the heat-generating circuit and formed with a recessed groove portion for mounting the optical waveguide device When the optical waveguide device is mounted on the bottom face of the heat-transmitting section formed with the recessed groove section, the optical waveguide device can be heated not only from its bottom face, but also from its side faces by edge parts constituting the recessed groove portion, whereby the temperature uniformity can be enhanced.

Heater module and optical waveguide module

To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m&times;K or higher and a thermal expansion coefficient of 20&times;10 /&deg; C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al&mdash;SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al&mdash;SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600&deg; C. in a non-oxidizing atmosphere.

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

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Osaka, Japan

Yoshiyuki Hirose