The Furukawa Electric Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Furukawa Automotive Systems Inc.

Yoshiyuki Hirayama

Hitoshi Shimizu

Michinori Irikawa

Kazuaki Nishikata

Takuro Yamada

Masakazu Kozawa

Masanori Yamasaki

Teruhiro Sato

Tomio Wada

Tatsuya Yuasa

Sumio Sugata

Manabu Kojima

Nobuaki Sakai

Naoko Omori

An electromagnetic shielding tube has a resin inner layer as the innermost layer, a resin outer layer as the outermost layer, and a metal metal-layer between the inner layer and the outer layer. The bonding strength between the outer layer and the metal layer is made weaker with respect to the bonding strength between the inner layer and the metal layer. For example, while an adhesive layer is provided between the inner layer and the metal layer, the outer layer can be directly extrusion coated onto the metal layer without providing an adhesive layer or the like between the outer layer and the metal layer.

Electromagnetic shielding tube

Strained superlattice semiconductor photodetector having a side contact

To provide a Schottky junction device having a super-lattice arranged in the Schottky interface in order to secure a high Schottky barrier and at the same time showing a high speed response by resolving the phenomenon of piled-up holes at the upper edge of the valence band, while maintaining the height of the Schottky barrier. A Schottky junction device having a Schottky junction of a semiconductor and a metal and a superlattice on the interface of the semiconductor and the metal, wherein the upper edge of the valence band of said superlattice is varied to show a turn to a specific direction. The phenomenon of hole-piling up at the upper end of the valence band is resolved while maintaining the height of the Schottky barrier and consequently such a Schottky junction device shows an excellent high speed response.

Schottky junction device having a Schottky junction of a semiconductor

Single flat metal sheet blank in which thin metallic parts including side frames which are to form side walls, a shield plate and external lead and the like are connected together in a developed state in positional relationships necessary for the assembly of the high-density circuit module. A circuit board is then placed on one side of the shield plate of the flat metal sheet blank. Terminals having pedestals are formed on the shield plate. The terminals are inserted into holes formed in the circuit board and connected to conductors on the circuit board. Then, operations such as severance or bending are effected on selected connecting portions at which the thin metallic parts arranged in developed state are inter-connected, and required processings are executed on the portions to be jointed, whereby the circuit module is completed. According to this production method, a space for receiving circuit components is formed between the circuit board and the shield plate, so that both sides of the circuit board can be used for mounting the circuit components, whereby a high packaging density is attained.

High-density circuit module and method of producing the same

There is provided a high-quality semiconductor laser device having a current confinement feature along with a method of manufacturing the same in a simple manner. The upper clad layer 4 of a semiconductor laser device is a semiconductive layer made of a compound of elements of the III and V groups doped with an amphoteric impurity substance and the electric resistance of the lateral slopes is greater on the top of the mesa than on the upper clad layer 4 of the mesa. A method of manufacturing a semiconductor laser device comprises a step of repeating a cycle of crystal growth operation of sequentially forming a layer of an element of the III group, a layer of an amphoteric impurity substance and a layer of an element of the V group on said substrate by means of an MBE technique to produce said upper clad layer made of a compound of elements of the III and V groups.

Semiconductor laser device featuring group III and IV compounds doped

Growing community of inventors

Yokohama, Japan

Yoshiyuki Hirayama