Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Yoshiyuki Hattori

Shigeki Imafuku

Junichi Hada

Shozo Fukuda

Akira Noudo

Takuya Yamazaki

Takahiro Noda

Toru Chikuma

Satoshi Nonaka

Teppei Kawaguchi

Ken Takahashi

Yoshihiko Misawa

Yoshinori Isobata

Takeyuki Kawase

Takeshi Kuribayashi

Hiroshi Uchiyama

Takashi Yazawa

Hiroshi Okamura

Kimiaki Sano

Akira Iizuka

Youichi Tanaka

Masuo Masui

Toshio Yano

Eigo Sarashina

Takanori Yoshitake

Toshiyuki Kino

Tamaki Ogura

Iwao Kanetaka

Hitoshi Nakamura

In an electronic component mounting method, electronic components are picked up from a component supply unit in which two tray supply mechanisms are arranged, and mounted on substrates. In the method, both of the tray supply mechanisms are allowed to hold trays storing therein the electronic components to be mounted on the substrates. If shortage of the components occurs in one tray supply mechanism during a component mounting process, a target for picking up the electronic components is switched to the other tray supply mechanism. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.

Electronic component mounting method

In an electronic component mounting method, electronic components are picked up from a component supply unit in which first and second tray supply mechanisms are arranged, and mounted on substrates. In the method, a first substrate and a second substrate different in type from the first substrate are transported by first and second substrate transport lanes, respectively, and a first component to be mounted on the first substrate and a second component to be mounted on the second substrate are supplied by the first and second tray supply mechanisms, respectively. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.

Method of mounting electronic parts

The present invention provides a device and a method for determining whether or not a component holder is good, which enable detecting component holders that are to affect correct component recognition and further enable preventing interferences between constituent devices, a component mounting apparatus with the determining device, and a component mounting method. The determining device has an illuminating device, a CCD camera and a controller to determine whether or not a suction nozzle is good based on luminance at a component hold face of the suction nozzle. The suction nozzle having light reflectance of the component hold face increased to a level whereat a correct recognition of an electronic component held by the suction nozzle is affected, can be detected accordingly. An interference preventing device is also provided, so that interference between the CCD camera and the suction nozzle can be prevented.

Method for determining whether a component holder is defective

An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Apparatus for mounting components on substrate

Apparatus and method for mounting components on substrate

A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.

Component mounter, service supplier, and service supplying method

A component-lack advance notice method, a component-lack advance notice apparatus, and a component mounting apparatus including the component-lack advance notice apparatus, wherein a producible count determination part and advance notice parts are provided, so that an advance notice time from an advance notice of a lack of components to an actual occurrence of a lack of components is set beforehand. The producible count determination part obtains each advance notice remaining count of components to be supplied within the advance notice time from each component feed part on the basis of the advance notice time, and notifies a lack of components in advance on the basis of the advance notice remaining count.

Apparatus and method for notifying lack of component in advance, component mounting apparatus, and article of manufacture comprising computer usable medium

Growing community of inventors

Kofu, Japan

Yoshiyuki Hattori