Kabushiki Kaisha Toyota Chuo Kenkyusho

Toyota Jidosha Kabushiki Kaisha

Tohoku University

Yoshiyuki Hata

Motohiro Fujiyoshi

Yoshiteru Omura

Yutaka Nonomura

Hirofumi Funabashi

Teruhisa Akashi

Takahiro Nakayama

Masayoshi Esashi

Shuji Tanaka

Hitoshi Yamada

Ui Yamaguchi

Mitsutoshi Makihata

Masanori Muroyama

Keiichi Shimaoka

Kazuyoshi Tomita

Takashi Ozaki

Norio Fujitsuka

Tetsuo Narita

Isao Aoyagi

Kanae Murata

A sensor unit includes at least three kinesthetic-sense sensors arranged along a plane, each including a first force-receiving part configured to receive an external force. The sensor unit includes a connecting member including a second force-receiving part configured to receive an external force, configured to transfer the external force received by the second force-receiving part to each first force-receiving part and connecting the first force-receiving parts with each other. The sensor unit includes an output unit configured to output signals corresponding to a pressing force in an orthogonal-axis direction orthogonal to the plane and pressing forces in two axial directions parallel to the plane, respectively, the pressing forces being components of divided forces of the external force received by the second force-receiving part, received by the respective first force-receiving parts through the connecting member.

Sensor unit, sensor system, robot hand, robot arm, server device, calculation method, and program

A sensor system includes a substrate with a reference plane, a plurality of kinesthetic-sense sensors disposed on the substrate, each of the plurality of kinesthetic-sense sensors being configured to output signals of three axial directions corresponding to an orthogonal-axis direction orthogonal to the reference plane and two axial directions parallel to the reference plane, respectively, according to an external force from an object received at a force receiving part, a control unit configured to determine whether or not a value of each of the signals is larger than a predetermined threshold, and calculate a pressing force in the orthogonal-axis direction or a moment around the orthogonal axis received from the object based on a result of the determination, and an output unit configured to output a result of the calculation.

Sensor system for calculating pressing force or moment based on signals output by kinesthetic-sense sensors, robot hand including the sensor system, and method for calibrating the sensor system

A sensor system according to the present disclosure includes a substrate, a force sensor, a calculation unit, and an output part. The substrate includes a reference plane and an inclined surface. The force sensor is provided on the inclined surface and outputs signals in three-axis directions that correspond to an orthogonal axis direction that is orthogonal to the inclined surface and two-axis directions that are parallel to the reference plane. The calculation unit calculates a pressing force in each coordinate axis direction of rectangular coordinates formed of an axis vertical to the reference plane and two axes parallel to the reference plane and moments around the respective coordinate axes of the rectangular coordinates. The output part outputs calculation results.

Sensor system and robot hand

Teaching disclosed herein is an apparatus comprising a support layer. The support layer may be adapted for supporting a heat generator, wherein the support layer includes a flow passage. The flow passage may seal working fluid therein. The flow passage may extend along a thickness direction of the support layer.

Apparatus and method of manufacturing a support layer

An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.

Integrated device

A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives.

Dynamic quantity sensor and dynamic quantity sensor system

In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the third layer is formed. The first trench forms a first part of an outline of the movable portion in a view along the stacked direction. The second trench forms a second part of the outline of the movable portion in the view along the stacked direction. At least a part of the first trench overlaps with the first extending portion in the view along the stacked direction.

MEMS structure and manufacturing method thereof

A structure having a first movable portion displaced perpendicular to a substrate surface and a second movable portion displaced parallel to the substrate surface is realized by a laminated structure employing a nested structure for the first portion and the second portion. The laminated structure is provided with inner and outer movable portions. A y spring is connected to the outer portion, and the outer portion is supported in a y-axis direction by the y spring at a height apart from an outer substrate. A z spring is connected to the inner portion, and the inner portion is supported in a z-axis direction by the z spring at a height apart from the outer substrate. The outer portion and the z spring are at different heights from the substrate, and the z spring overpasses across the outer portion at a height apart from the outer movable portion.

Laminated structure provided with movable portion

When forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in which a trench is formed in a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern which compensates for sudden changes in the width of the trench is formed at a place at which the width of the trench changes suddenly. In the semiconductor layer of the above-described semiconductor device, since a compensation pattern is formed at a place at which the trench width changes suddenly, in the case where forming the trench using a deep RIE method, the occurrence of steep inclined portions arising from semiconductor residue can be prevented. Consequently, when forming a trench of a narrow width in a thick semiconductor layer, the occurrence of semiconductor residue can be prevented.

Growing community of inventors

Nagoya, Japan

Yoshiyuki Hata