Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matsushita Electronics Corporation

Yoshiyuki Arai

Kenji Maeda

Takashi Yui

Takashi Takata

Fumito Itou

Yasutake Yaguchi

Shigeru Nonoyama

Hajime Homma

Hiroki Naraoka

Takeshi Kawabata

Takao Ochi

Hideki Takehara

Masanori Minamio

Toshiyuki Fukuda

Toshitaka Akahoshi

Yoshiaki Takeoka

Yuichiro Yamada

Kouichi Yamauchi

Fumito Ito

The electronic component integrated module includes a wiring board; an electronic component provided on the wiring board; solder for electrically connecting the electronic component onto the wiring substrate; and an encapsulating resin for encapsulating the electronic component and the solder. The average linear thermal expansion coefficient &#x3b1; of the encapsulating resin, which is calculated by using the glass transition temperature of the encapsulating resin, a linear thermal expansion coefficient &#x3b1;1 obtained at a temperature lower than the glass transition temperature, a linear thermal expansion coefficient &#x3b1;2 obtained at a temperature exceeding the glass transition temperature, room temperature, and a peak temperature of reflow packaging of the electronic component integrated module, is not less than 17&#xd7;10/&#xb0; C. and not more than 110&#xd7;10/&#xb0; C.

Electronic component integrated module

In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions.

Module with embedded electronic components

A stacked chip semiconductor device including: a substrate having electrode pads; a first semiconductor chip that is flip-chip-packaged on the substrate via a first adhesive layer; a second semiconductor chip that is mounted on an upper part of the first semiconductor chip and that has electrode pads; wires for electrically connecting the electrode pads of the second semiconductor chip and the electrode pads of the substrate; and a molded resin for encapsulating the first semiconductor chip, the second semiconductor chip and the wires, the first adhesive layer forming a fillet at the periphery of the first semiconductor chip. The first semiconductor chip is disposed with its central axis being offset from a central axis of the substrate, the offset being provided so that the first semiconductor chip is shifted toward a side opposite to a side where the fillet has a maximum length from the periphery of the first semiconductor chip. Thereby, influences of the fillet made of the adhesive are suppressed, allowing miniaturization of the device and improvement in the mass-productivity.

Stacked chip semiconductor device and method for manufacturing the same

A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Semiconductor device and method for fabricating the same

A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.

Semiconductor device and method for manufacturing the same

A semiconductor device has a substrate having electrode pads, a first semiconductor chip mounted on the substrate with a first adhesion layer interposed therebetween, a second semiconductor chip mounted on the first semiconductor chip with a second adhesion layer interposed therebetween and having electrode pads on the upper surface thereof, wires for bonding the electrode pads of the substrate and the electrode pads of the second semiconductor chip to each other, and a mold resin sealing therein the first and second semiconductor chips and the wires. The peripheral edge portion of the first adhesion layer is protruding outwardly from the first semiconductor chip and the peripheral edge portion of the second semiconductor chip is protruding outwardly beyond the peripheral edge portion of the first semiconductor chip.

The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.

Printed wiring board, IC card module using the same, and method for producing IC card module

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Kyoto, Japan

Yoshiyuki Arai