Fujitsu Corporation

Fujitsu Frontech Limited

Fijitsu Limited

Yoshiyasu Sugimura

Shigeru Hashimoto

Shunji Baba

Tsuyoshi Niwata

Satoru Nogami

Manabu Kai

Mimpei Miura

Toru Maniwa

Takashi Yamagajo

Hideo Miyazawa

Takayoshi Matsumura

Yusuke Kawasaki

Yasuyuki Oishi

Naoki Ishikawa

Toshiaki Ibi

Hiroshi Kobayashi

Hidehiko Kira

Teruhisa Ninomiya

Yasuyuki Higashiura

Hiroshi Kawamata

Noritsugu Ozaki

Hisayuki Nishimura

Noritsugu Osaki

Tatsuro Tsuneno

Akihiko Saito

Mao Kikukawa

Yasunao Mizutani

Shunji c/o Fujitsu Limited Baba

An RFID tag includes a sheet-like substrate, an IC chip disposed on a first face of the substrate, a conductive adhesive that is positioned around the IC chip along the first face and fixes the IC chip to the substrate, an antenna pattern formed on a second face, of the substrate, that is opposite to the first face, and a through hole that penetrates the substrate toward the conductive adhesive around the IC chip and electrically connects the antenna pattern with the IC chip.

RFID tag

An RFID tag includes: a flexible, sheet-shaped substrate; an antenna pattern that is formed on the substrate; an IC chip that is mounted on the substrate and that is connected to the antenna pattern; an adhesive member that adheres the IC chip to the substrate; and a reinforcement member that covers the IC chip and the adhesive, and that is at a position such that a central portion of the reinforcement member is offset along a length direction of the substrate with respect to the IC chip and the adhesive member.

A disclosed RFID tag includes a substrate; a chip bonded to the substrate with an adhesive, and including a first connection terminal on a first surface, the first surface being on a side bonded to the substrate; a first antenna wiring formed on the substrate, and electrically coupled to the first connection terminal; and an adhesive layer formed of the adhesive, and including a base portion and a filet portion, the base portion being in an area of the substrate opposed to the first surface of the chip, the filet portion being in an area of the substrate surrounding the chip. The first antenna wiring is electrically coupled to the first connection terminal via a plurality of paths at an outer edge of the filet portion of the adhesive layer.

A disclosed RFID tag includes: a base member; a semiconductor chip mounted on the base member; and an island-shaped reinforcing member covering the semiconductor chip and being configured to reinforce the base member. The reinforcing member has a side portion to which a recess is provided. The recess serves as an originating point of a fold line such that the fold line is formed away from the semiconductor chip when the reinforcing member is folded.

An RFID tag includes a first flexible sheet covering a surface of a base part, an antenna and an IC chip; a second flexible sheet covering an another surface of the base part; a first reinforcing member including third and fourth sheets and covering the chip and a connecting portion of the chip and the antenna, the third sheet having flexibility and elasticity and being disposed on the first sheet, the fourth sheet having flexibility and being disposed on the third sheet; a second reinforcing member including fifth and sixth sheets and covering the chip and the connecting portion, the fifth sheet having flexibility and elasticity and being disposed on the second sheet, the sixth sheet having flexibility and being disposed on the fifth sheet; and an outer member having flexibility and elasticity and covering the first and the second sheets and the first and the second reinforcing members.

An RFID tag is disclosed that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.

A tag patch antenna includes: a slit formed in the vicinity of an edge of an antenna pattern along a part of the edge; and a feeding point to which a tag LSI is connected and which is formed by cutting an intermediate portion of the part of the edge separated by the slit from a body of the antenna pattern by a width of the slit.

Tag patch antenna and RFID tag using tag patch antenna

A wireless tag includes a tag-inlet including an antenna pattern formed on a base and an IC chip connected to the antenna pattern on the base, and a flexible member configured to seal the tag-inlet inside the flexible member. In the wireless tag, the tag-inlet is sealed in the flexible member with folded, and the folded tag-inlet has a dielectric spacer formed of the flexible member between the folded tag-inlet.

Wireless tag and manufacturing method

According to an aspect of the invention, a wireless tag includes a base member that is flexible and on a surface of which a wiring pattern is formed, a wireless circuit chip that is mounted on the base member and connected to the wiring pattern; protective members that cover the base member and the wireless circuit chip and are lower in hardness than the base member, and a plurality of spherical projections that are arranged on the surfaces of the protective members, higher in hardness than the base member, and so arranged as to interfere with other adjacent spherical projections when at least the protective members are bent beyond a predetermined angle.

Wireless tag and method of producing wireless tag

An RFID tag having a tag antenna and an LSI chip, comprising: a power-supply pattern on which the LSI chip is mounted; a patch antenna that functions as the tag antenna; and a high-frequency connection section that makes a high-frequency connection between the power-supply pattern and the patch antenna. The high-frequency connection section is formed, for example, by forming a slot in the patch antenna, layering one end of a small dipole antenna that functions as the power-supply pattern over the slot so that it crosses over the slot, and supplying power from the small dipole antenna to the patch antenna.

RFID tag and manufacturing method thereof

A radio tag is disclosed that includes an inlet having a base member, an antenna pattern, and a circuit chip for performing radio communications, the antenna pattern and the circuit chip being provided in the base member and includes a spacer on which the inlet is provided. The spacer has a length in a longitudinal direction thereof twice or more as great as a length of the inlet in the longitudinal direction. The spacer has a flection part at which the spacer is foldable in such a manner as to form an attached surface to be attached to an attached subject of the radio tag.

Radio tag and method for manufacturing radio tag

A method of manufacturing RFID tags. A base sheet member is formed by fixedly attaching unit base substrates to a belt-like first sheet member at predetermined space intervals. Each unit base substrate is formed with an antenna pattern and has a non-contact communication-type IC chip mounted thereon. An upper-layer sheet member is formed by arranging reinforcing members between elastic, belt-like second and third sheet members, and is laminated on a surface of the first sheet member toward the unit base substrates such that each IC chip and each reinforcing member overlap each other in plan view. Regions each containing one unit base substrate are sequentially cut out from a laminate of the upper-layer sheet member and the base sheet member, thereby making RFID units.

RFID tag manufacturing method and RFID tag

An RFID tag includes a semiconductor package, a substrate and an antenna pattern. The semiconductor package includes a semiconductor chip encapsulated therein and a plurality of connection terminals thereon. The plurality of connection terminals includes signal terminals and dummy terminals. The semiconductor package is mounted on the substrate. The antenna pattern is formed on the substrate and is electrically connected to the signal terminals. The antenna pattern is extended so as to overlap with at least a part of a bottom region of the semiconductor package.

A radio-frequency identification (RFID) tag includes: a plate-shaped sealing piece made of an elastic material. An inlet is enclosed within the sealing piece. The inlet includes an electronic component and an antenna connected to the electronic component. A pair of reinforcing pieces are located respectively on the front and back surfaces of the sealing piece so as to sandwich the electronic component. The reinforcing pieces are made of a first material harder than the elastic material. A joint piece configured to couple the reinforcing pieces to each other. The joint piece is made of a second material harder than the elastic material.

Radio-frequency identification tag

An RFID tag includes an inlay which has a base, an antenna formed on the base, and an IC chip. The IC chip is enclosed in a surface mount package and soldered to the antenna and carries out radio communication through the antenna. The RFID tag further includes underfill that fills a gap between the base and the surface mount package, and a sheath protecting material enclosing the entire inlay.

Growing community of inventors

Inagi, Japan

Yoshiyasu Sugimura