Chisso Corporation

Yoshiya Kutsuzawa

Kouichi Kunimune

Shiro Konotsune

Haruo Kato

Michiyuki Ashihara

Narutoshi Kimoto

Hiromi Egawa

Coated granular pesticide method for producing the same and applications

The present invention intends to provide a cured material of a silicon-containing polyimide having high heat resistance, low coefficient of thermal expansion, no brittleness and high hardness. In order to enable liquid coating and impregnation, a silicon-containing soluble polyimide precursor is first prepared. The precursor may be prepared by mixing five compounds of ##STR1## (R.sup.1 is a tetravalent carbon cyclic aromatic group), NH.sub.2 --R.sup.2 --NH.sub.2 (R.sup.2 is an aliphatic group, an alicyclic group, an aromatic aliphatic group or a carbon cyclic aromatic group, a polysiloxane group or 1,3,5-triazine group having a substituent), NH.sub.2 --R.sup.3 --SiR.sup.4.sub.3-k X.sup.1.sub.k and NH.sub.2 --R.sup.3 --SiR.sub.3-m.sup.4 X.sup.1.sub.m (R.sup.3 is --(CH.sub.2).sub.s --, ##STR2## wherein s is an integer of 1 to 4, and R.sup.4 is an alkyl group, a phenyl group or an alkyl-substituted phenyl group and SiX.sub.4.sup.2, X.sup.1 and X.sup.2 are independently an alkoxy group, an acetoxy group, a halogen or a hydroxyl group), and then heating the mixture. Coating or impregnation of this precursor is then given and afterward heated at a temperature of 50.degree. to 500.degree. C., thereby obtaining the cured material of the silicon-containing polyimide.

Silicon-containing soluble polyimide precursor, its cured material, and

The present invention provides a process for the production of silicon-containing polyimide presursors that have a viscosity most suitable for application, and when baked, can form a coating low in hygroscopicity, heat resistant, and having powerful adhesion, and a process for their cured silicon-containing polyimide. A process for the production of silicon-containing polyimide precursors having a logarithmic viscosity number of 0.05 to 5 dl/g by reacting A.sup.1 mol of fluorine-containing diacid anhydride, A.sup.2 mol of a diacid anhydride, B.sup.1 mol of a fluorine-containing diamine, B.sup.2 mol of a diamine, and C mol of an aminosilane with the mixing ratio of them such that A.sup.1, A.sup.2, B.sup.1, B.sup.2, and C are within ranges having prescribed relationships, and a process for the production of a silicon-containing polyimide by baking a solution of said precursor at 50.degree. to 500.degree. C.

Processes for the production of silicon-containing polyimides

A process for producing a silicon-containing polyamic acid affording a silicon-containing polyimide having a low thermal expansion coefficient and a process for producing the silicon-containing polyimide are provided, the former process comprising reacting pyromellitic acid dianhydride (A.sup.1 mols) and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (A.sup.2 mols) with a diamine of the following formula (I) (B mols) and an aminosilicon compound of the formula (II) so as to satisfy the following expressions (III) and (IV): ##STR1## wherein R.sup.1 is methyl, ethyl, methoxy, ethoxy or halogen; R.sup.2 is alkyl or alkyl-substituted phenyl; X is a hydrolyzable alkoxy, acetoxy or halogen; m is 0, 1 or 2; n is 1 or 2; and k is 1, 2 or 3; and

Process for producing a low thermally expansive and highly adhesive

A process for producing a silicon-containing polyamic acid of a specified inherent viscosity as a precursor affording polyimide resins having a considerable extent of heat resistance as adhesives or resins for multilayer laminated composite materials, and a good adhesion onto inorganic materials, metals or resins, and a crosslinked silicon-containing polyimide resin prepared from the polyamic acid are provided, which process comprises reacting a tetracarboxylic acid dianhydride of formula (1) (A mols), a diamine of formula (2) (B mols) and an aminosilicon compound of formula (3) (C mols), satisfying the expressions of (4) and (5): ##STR1## wherein R.sup.1 is a tetravalent carboxylic aromatic group; R.sup.2 is an aliphatic, alicyclic, aromatic aliphatic or carboyclic aromatic group each of a specified number of carbon atoms, a specified polysiloxane group, or a formula of ##STR2## wherein R.sup.8 is a specified hydrocarbon group or hydrogen atom; ##STR3## (s: 1 to 4); R.sup.4 is alkyl, phenyl or alkyl-substituted phenyl each of a specified number of carbon atoms; X is alkoxy, acetoxy or halogen; and 1.ltoreq.k.ltoreq.3, and which polyimide resin is produced by baking a solution containing the above polyamic acid at 50.degree. to 450.degree. C.

Process for producing highly adherent silicon-containing polyamic acid

A novel soluble polyimide-siloxane precursor having a good storage stability in solution and forming a superior coating on silicon wafer, glass, etc. under heating conditions of low temperature and short time; a process for producing the same; and a cross-linked polyimidesiloxane obtained by heating the above precursor are provided, which precursor has

Soluble polyimide-siloxane precursor, process for producing same and

A novel soluble polyimide-siloxane precursor useful for forming a superior coating on silicon wafer, glass, etc. and a process for producing the same are provided, which precursor has an imide-amic acid chain part expressed by --R.sup.3 --(I)--R.sup.2 --(I)].sub.n R.sup.3 --, bonded by a bonding structure expressed by --SiR.sup.4.sub.3-m Y.sup.1.sub.m-1 --O--SiR.sup.4.sub.3-m Y.sup.1.sub.m-1 --, wherein (I) is either one of formulas (2), (3) or (4) ##STR1## wherein R.sup.1 is a tetravalent carbocyclic aromatic group; R.sup.2, R.sup.3, R.sup.4 and Y.sup.1 each are a specified group; 1.ltoreq.m.ltoreq.3; the precursor further being terminated by Y.sup.2.sub.m R.sup.4.sub.3-m Si-- wherein Y.sup.2 is a specified group and having a percentage imidization as defined relative to the quantities of (2), (3) and (4), of 50-100% and also an inherent viscosity as specifically defined, of 0.05 to 5 dl/g, the above n being an integer defined so as to give the above inherent viscosity value.

Soluble polyimide-siloxane precursor, process for producing same, and

A silicone-polyimide precursor which affords a coating having a conspicuous adhesion onto silicon wafer, glass, etc. and also an improved strength, hardness, etc. after baking, and a process for producing the same are provided,

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Yokohama, Japan

Yoshiya Kutsuzawa