Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Toray Silicone Company Limited

Dow Toray Co., Ltd.

Dow Corning Toray Silicone

Other

Dow Corning Corporation

Minolta Company, Ltd.

Idemitsu Kosan Company, Limited

Yoshitsugu Morita

Haruhiko Furukawa

Hiroshi Ueki

Kazuo Kobayashi

Tomoko Kato

Ryuji Tachibana

Hiroji Enami

Minoru Isshiki

Noriyasu Yokoyama

Makoto Yoshitake

Michitaka Suto

Koji Nakanishi

Keiji Yoshida

Tadashi Okawa

Isao Ona

Tomohiro Iimura

Toshio Saruyama

Tsutomu Naganawa

Hiroki Ishikawa

Kazuhiro Nishijima

Kasumi Takeuchi

Junji Nakanishi

Katsutoshi Mine

Mitsuo Hamada

Masaru Ozaki

Toyohiko Yamadera

Asao Harashima

Donald Taylor Liles

Hideaki Yasunaga

Hiroyuki Fukuda

David Joseph Romenesko

Seiji Hori

Makoto Kobayashi

Toru Masatomi

Akihiko Shirahata

Brian Harkness

Motoshi Sasaki

Ken Tanaka

Takayuki Aso

Koji Shiromoto

Atsushi Sasaki

Hidekatsu Hatanaka

Masayoshi Terada

Tadashi Hamachi

Shoichi Shida

Mari Wakita

Shinichi Yamamoto

Takashi Sagawa

Tsuneo Hanada

Atsushi Sakuma

Atsushi Togashi

Kazuhiko Ando

Masaaki Amako

Takaaki Hikosaka

Tomoharu Nishikawa

Yasue Kanzaki

Ann Walstrom Norris

Koichi Takenaka

Kiyotaka Sawa

Shuji Sakamoto

Hiroaki Yoshida

Fumito Nishida

Hidetoshi Kondo

Stanton James Dent

Yusuke Miyamoto

Taro Koshii

Yoshinori Taniguchi

Jacob William Steinbrecher

Kevin Edward Lupton

Chiichiro Hasegawa

Akihiro Nakamura

Michelle R Cummings

Hideo Shinmi

Masashi Murakami

Tammy Cheng

Emil Radkov

Ryuko Manzoji

Malinda Howell

Tadashi Takimoto

Satoshi Miyamae

Osamu Tanaka

Tammy Lea Bratcher

Ozaki Masaru

Masahiko Uomori

Takeshi Yoshizawa

Yasuaki Horikawa

A composite silicone rubber particle is disclosed, wherein a part or entire surface of the silicone rubber particle is covered by a fine particle, a surface of which is modified by a functional group containing quaternary ammonium salt. Manufacturing methods of the composite silicone rubber particle are also disclosed, as well as a cosmetic product composition containing the composite silicone rubber particle. The composite silicone rubber particle has hydrophilicity and dispersibility while maintaining excellent fluidity, contains no harmful methanol, and has antimicrobial activity.

Cosmetic composition, cosmetic, and external preparation for skin

Cured silicone particles are disclosed. The cured silicone particles are obtained by curing a curable silicone composition comprising at least components (A) through (C), wherein components (A) and (B) are polyorganosiloxanes having certain average formulas, and component (C) is a catalyst. The average particle size of the cured silicone particles is from 0.1 to 500 &#x3bc;m. Related methods and a cosmetic material comprising the cured silicone particles are also disclosed.

Cured silicone particles and cosmetic incorporating same therein

An organopolysiloxane represented by the following average unit formula: (RSiO)(XRSiO)(OSiR&#x2014;Y&#x2014;RSiO)is provided. Rand Reach individually represent a C-Calkyl group, C-Caryl group, or C-Caralkyl group. X represents a C-Calkenyl group or a siloxane residue and Y represents a siloxane linking group. Alternatively X represents a C-Calkenyl group or a silphenylene residue and Y represents a silphenylene linking group. Subscript 'a' is a number in a range of 0.65 to 0.90, 'b' is a number in a range of 0.10 to 0.35, &#x201c;c&#x201d; is a number in a range of 0 to 0.10, and &#x201c;a&#x201d;+&#x201c;b&#x201d;+&#x201c;c&#x201d;=1.00. The organopolysiloxane has a siloxane residue or silphenylene residue having a silicon atom-bonded hydrogen atom in an organopolysiloxane resin block. The organopolysiloxane generally exhibits high refractive index and high transparency as well as excellent handleability.

Organopolysiloxane, production method thereof, and curable silicone composition

This invention relates to a curable silicone composition comprising: (A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by the following average unit formula: (RSiO)(RSiO)(RSiO)(SiO)(XO)wherein, Reach independently represent an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two Rin a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.5; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a cerium-containing organopolysiloxane; and (E) a hydrosilylation reaction catalyst. The curable silicone composition does not develop cracks due to thermal aging and can form a cured product having little yellow discoloration.

Curable silicone composition, cured product thereof, and optical semiconductor device

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organosiloxane (C) having silicon-bonded hydrogen atoms at both molecular terminals, an organopolysiloxane (C) having at least two silicon-bonded hydrogen atoms in a molecule, or a mixture of components (C) and (C); and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and can form a cured product with a high refractive index and low gas permeability when cured.

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by a specific average unit formula, (B) an optional straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has high reactivity and forms a cured product with low gas permeability.

Organopolysiloxane, curable silicone composition, cured product thereof, and optical semiconductor

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the average unit formula; (B) a straight chain organopolysiloxane having at least two alkenyl groups in a molecule and having no silicon-bonded hydrogen atoms; (C) an organosiloxane i) represented by the general formula, an organopolysiloxane (C) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula, or a mixture of components (C) and (C); and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having a high refractive index and a low gas permeability.

Curable silicone composition, cured product thereof, and optical semiconductor

This invention relates to a silicone oil emulsion that contains cross-linked silicone particles in drops of silicone oil which have an average particle diameter of 0.1 to 500 &#x3bc;m and are dispersed in water, wherein the silicone oil contains epoxy groups, acryl groups, methacryl groups, silicon-bonded alkoxy groups, or silicon-bonded hydroxyl groups but is free of silicon-bonded hydrogen atoms and alkenyl groups, said cross-linked silicone particles is formed by a hydrosilation reaction. Furthermore, this invention also relates to a silicone oil composition obtained by removing water from said emulsion.

Emulsion, its manufacturing method and silicone oil composition

A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.

Method of manufacturing a semiconductor device and a semiconductor device produced thereby

A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein Rdesignates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; Rdesignates identical or different, substituted or unsubstituted alkylene groups; Rdesignates substituted or unsubstituted monovalent hydrocarbon groups; Rdesignates alkyl groups or hydrogen atoms; 'a' is a positive number that satisfies the following condition: 0=a=3; and 'x', &#x2018;y&#x2019;, and &#x2018;z&#x2019; are positive numbers that satisfy the following conditions: 0&#x3c;x&#x3c;0.1; 0&#x3c;y&#x3c;1; 0=z&#x3c;0.1; and (x+y+z)=1); and a curable polymer composition comprising: (A) the aforementioned silicon-containing polymer; (B) an organosilicon compound that contains in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst.

Silicon-containing polymer, method of manufacturing thereof, and curable polymer composition

To provide a silicone oil emulsion that can improve the properties of cosmetic materials and that contains crosslinked silicone particles in water-dispersed silicone oil droplets; a method of producing this silicone oil emulsion; and a silicone oil composition thereof. This invention is a silicone oil emulsion comprising crosslinked silicone particles having an average particle size of 0.05 to 100 &#x3bc;m in silicone oil droplets that are dispersed in water and that have an average particle size of 0.1 to 500 &#x3bc;m wherein the silicone oil is an alkyl-modified silicone oil that has a silicon-bonded alkyl group having at least 4 carbons and the crosslinked silicone particles preferably have a silicon-bonded alkyl group having at least 4 carbons. Also, a silicone oil composition as provided by removing the water from this silicone oil emulsion.

Silicone oil emulsion, method of producing same, and silicone oil composition

A curable silicone composition comprising: (A) a liquid organopolysiloxane having in one molecule at least two epoxy groups; (B) a compound containing groups that react with the epoxy groups; (C) a thermally conductive filler; and (D) a silicone powder, preferably, an epoxy-containing silicone powder; possesses excellent handleability and workability in combination with low viscosity and that, when cured, forms a cured body of excellent elasticity, adhesiveness, and thermal conductivity.

Curable silicone composition and cured product thereof

A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R&#x2014;(RSiO)RSi&#x2014;R-A, wherein Ris substituted or unsubstituted mono-valent hydrocarbon group that does not contain an aliphatically unsaturated bond, Ris a divalent organic group, A is a siloxane residue with a specific average unit formula, and m is an integer with a value of at least 1; and (C) a curing agent for epoxy resin, exhibits excellent handling and curing characteristics and that cures to give a cured product that exhibits excellent flexibility and adhesiveness.

Curable silicone composition and electronic components

A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (RSiO)(RSiO)(RSiO)(SiO)(wherein R, R, and Rare each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of Rare aryl groups, and a, b, c, and d are numbers that satisfy 0&#x2266;a&#x2266;0.8, 0&#x2266;b&#x2266;0.8, 0.2&#x2266;c&#x2266;0.9, 0&#x2266;d&#x3c;0.8, and a+b+c+d=1), and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a compound that has a group capable of reacting with the epoxy group; (C) a cure accelerator; and (D) a thermally conductive filler, has excellent handling characteristics and that cures rapidly to give a cured product that is highly thermally conductive, very flexible, highly adhesive, and very flame retardant.

Curable silicone composition and cured product therefrom

A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.

Curable silicone composition and electronic component

Growing community of inventors

Ichihara, Japan

Yoshitsugu Morita