Mitsubishi Electric Corporation

Yoshitsugu Hirayama

Hirofumi Inoue

Yoshifumi Mizuno

Daisuke Sasaki

Kohei Ando

Shingo Kitagawa

Koji Uyama

In a power conversion device, a semiconductor module, a bus bar assembly, and a smoothing capacitor are superposed on a cooler in the stated order from the cooler side. At least one of a cooling column-equipped member, which is at least one of the smoothing capacitor and the bus bar assembly, and the cooler is provided with a cooling column configured to transfer heat of the cooling column-equipped member to the cooler.

Power conversion device

The power conversion device includes a semiconductor module having a connection terminal, a cooler, a control board, a capacitor module, a cover, a case, and a connection busbar. The semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in the direction perpendicular to the top surface of the cooler. The capacitor module has a capacitor cell, a capacitor case, resin, and a capacitor busbar. The capacitor busbar has an inner extending portion, an opening-side extending portion, and an outer extending portion. The connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to the extending direction of the outer extending portion. The connection busbar has a capacitor connection portion at an end thereof on the outer extending portion side.

Growing community of inventors

Tokyo, Japan

Yoshitsugu Hirayama