Denka Company Limited

Denki Kagaku Kogyo Kabushiki Kaisha

Yoshitsugu Goto

Jun Watanabe

Hiroyuki Kurimura

Yoshiyuki Kobayashi

Takashi Domoto

Takako Hoshino

Isamu Ichikawa

Kenji Fukao

Yukihiro Morimoto

Takuya Okada

Kazuhiro Oshima

Gosuke Nakajima

Hayato Miyazaki

Kimihiko Yoda

Takeshi Asami

Norihiro Shimizu

Yuki Hisha

Tometomo Uchida

Kenji Nomura

Takako Tanigawa

Hiroki Uno

Shigeo Hiyama

Chiaki Takano

Hideki Hayashi

A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.

Composition

A composition having excellent curability and adhesive bonding ability is provided. A composition, comprising the following components (1) to (5): (1) a polymerizable vinyl monomer containing 10 to 70 parts by mass of (1-1), 10 to 60 parts by mass of (1-2), and 10 to 60 parts by mass of (1-3) based on 100 parts by mass of (1) the polymerizable vinyl monomer, in which (1-1) is a (meth)acrylic monomer represented by the formula (A) Formula (A) Z—O—R(wherein, Z represents a (meth)acryloyl group, and Rrepresents an alkyl group.), (1-2) is a (meth)acrylic monomer represented by the formula (B) (wherein, Z and Z′ represent a (meth)acryloyl group, and Rand R′ represent an alkylene group; Rand R′ may be the same as or different from one another; Rand R′ represent a hydrogen atom, or an alkyl group having 1 to 4 carbon atoms; Rand R′ may be the same as or different from one another; m and n represent an average number of moles of alkylene oxide added (proportion of alkylene oxide added)), (1-3) is a (meth)acrylic monomer that is a (meth)acrylic acid ester of a polyhydric alcohol; (2) a thermal radical polymerization initiator; (3) a photo-radical polymerization initiator; (4) an aromatic amine and/or pyridine derivative; and (5) an organic metal salt.

Speaker having an adhesive composition

A photocurable composition for three-dimensional modeling capable of high-speed modeling, a three-dimensional modeled object using the composition, and a method for producing the three-dimensional modeled object is provided. A photocurable composition for three-dimensional modeling, comprising a polymerizable organic compound component is provided. The photocurable composition has a steady flow viscosity of 30,000 mPa s or less measured with a rotary rheometer at 25&#xb0; C. and a shear rate of 0.01 per second. When the photocurable composition for three-dimensional modeling is irradiated with a light having a light intensity of 1.3 mW/cm2, G' becomes 1&#xd7;10Pa or more after a start of photopolymerization in an integrated light irradiation time of 4 seconds or less. After the start of photopolymerization, a maximum value of tan &#x3b4; on and after a gel point is 0.5 or more. The gel point is the point where G&#x2032;=G&#x2033; is satisfied for the first time after the start of photopolymerization. G&#x2032; is a storage shear modulus, G&#x2032; is loss shear modulus, and tan &#x3b4; is a loss tangent, each of which is calculated based on measurement data for 30 seconds per one measurement, measured with a rotary rheometer having a pair of parallel plate with a diameter of 10 mm and a measurement gap of 0.1 mm at a strain of 0.5% or less, a frequency of 0.1 Hz, and 25&#xb0; C.

Photocurable composition for three-dimensional molding, three-dimensional molded product, and method for producing three-dimensional molded product

A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more.

Resin composition

A two-component (meth) acrylic adhesive excellent in peel strength at low temperature and impact resistance is provided. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; and (4) an elastomer having no polymerizable unsaturated double bond at the end and having 10 to 30 mol % of a (meth) acrylonitrile. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; (4) an elastomer having a polymerizable unsaturated double bond at the end and having 10 to 30 mol % of a (meth) acrylonitrile; and (5) an elastomer having no polymerizable unsaturated double bond at the end.

Adhesive composition

Provided is a resin composition comprising (A) an epoxy compound, (B) an epoxy resin, and (C) a photocationic polymerization initiator. Preferably, this resin composition has a moisture content of 1000 ppm or less and a chlorine content of 1000 ppm or less. This resin composition is an energy beam-curable resin composition having accurate coating properties, excellent adhesiveness, low moisture permeability, excellent adhesive durability, and excellent storage stability.

Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cmat a wavelength of 365 nm while heating the bonded body to 150&#xb0; C.-300&#xb0; C.

Method for disassembling bonded body, and adhesive

Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavelength of 1 to 300 nm on to a bonded body that has been formed by using an adhesive composition to bond substrates together, which includes and is formed by one type or two or more types of meth (acrylate) that have one or more (meth)acryloyl groups, and by hardening of said adhesive composition. At least one of the substrates is permeable to the excimer light.

Method for separating bonded bodies using excimer light irradiation

Disclosed are a probe inspecting method for confirming the state of a probe for inspecting electric characteristics of an object to be inspected; and a curable resin composition for use in the method. The method is applied to repeat inspections and comprises the steps of bringing a cured resin of a curable resin composition into contact with a probe for inspecting electric characteristics of an object to be inspected, transferring a probe mark of the probe to the cured resin, confirming the state of the probe based on the transferred probe mark, and, after the transfer of the probe mark of the probe, heating the cured resin to a temperature at or above the glass transition temperature of the cured resin to erase the probe mark of the probe.

Probe inspecting method and curable resin composition

Disclosed is a resin composition having an excellent balance between shortness of curing time and longness of pot life. The resin composition contains (A) an organopolysiloxane having an alkenyl group, (B) an organopolysiloxane having a silicon atom-bonded hydrogen atom, (C) a hydrosilylation catalyst, (D) a silane coupling agent and (E) an unsaturated dicarboxylic acid ester. The component (B) contains (B-1) an organopolysiloxane having a molecular weight of not less than 5,000 but not more than 50,000 and (B-2) an organopolysiloxane having a molecular weight of not less than 100 but not more than 5,000, and the ratio of (B-2) to (B-1) is preferably not less than 0.01% by mass but not more than 20% by mass.

Growing community of inventors

Shibukawa, Japan

Yoshitsugu Goto