Ibiden Company Limited

Yoshitomo Tomida

Kiyotaka Tsukada

Tetsuya Muraki

Atsunari Yamashita

A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.

Semiconductor device and fabrication method therefor

The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m&#xb7;K or higher and a Vickers hardness of approximately 70 or lower.

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Gifu, Japan

Yoshitomo Tomida