Murata Manufacturing Co., Ltd.

Yoshito Saito

Takashi Hiramatsu

Yosuke Hirata

Yasuhiro Nishisaka

Hiroyuki Wada

Hideaki Tsuji

Makoto Ogawa

Jun Ikeda

Kazuhisa Uchida

Nagato Omori

Hiroyuki Ukai

Shinji Otani

Akihiro Tsuru

Satoshi Matsuno

Tomochika Miyazaki

Masaki Masuda

Hidekazu Tamura

Hisashi Fujii

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers, the multilayer body including an electrode facing portion in which the inner electrode layers are laminated to face each other with the dielectric layers interposed therebetween. The multilayer body has a thickness of at least about 1.5 mm in a lamination direction, a length of at least about 3.0 mm, and a width of at least about 1.5 mm. Each of the dielectric layers includes Ba, Ti, and Cl. A Cl concentration Cin the entire electrode facing portion satisfies about 10 wtppm&#x3c;C&#x3c;about 50 wtppm. On an imaginary central axis line, a Cl concentration Cin a central portion of the electrode facing portion and a Cl concentration Cin both end portions of the electrode facing portion satisfy about 0.5C&#x2264;C&#x3c;C.

Multilayer electronic component and method for manufacturing multilayer electronic component

A first outer electrode and first inner electrodes are supplied with an anode potential and a second outer electrode and second inner electrodes are supplied with a cathode potential when a monolithic ceramic capacitor is mounted and in use. The first outer electrode supplied with the anode potential has a thickness that is greater than a thickness of the second outer electrode supplied with the cathode potential.

Monolithic ceramic capacitor and structure for mounting the same

A method for manufacturing a laminated ceramic capacitor having a laminated body including a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The laminated body has a pair of mutually opposed principal surfaces extending in the direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces which respectively extend in directions orthogonal to the principal surfaces. The internal electrodes are 0.4 &#x3bc;m or less in thickness, and are located in an area defined by a width-direction gap of 30 &#x3bc;m or less interposed with respect to each of the pair of side surfaces and an outer layer thickness of 35 &#x3bc;m or less interposed with respect to each of the pair of principal surfaces.

Laminated ceramic electronic component

A multilayer ceramic capacitor that includes a layered body in which dielectric layers and internal electrode layers are layered alternately, an external electrode on a surface of the layered body and a plating layer on a surface of the external electrode. The external electrode contains Cu, and a protective layer containing CuO is provided at a joining portion between the external electrode and the plating layer. When heat is applied to the layered body after the external electrode is removed, a ratio of an arithmetic mean value Xa of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 350&#xb0; C. with respect to an arithmetic mean value Y of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 230&#xb0; C. and lower than or equal to 250&#xb0; C. (Xa/Y) is less than or equal to 0.66.

Multilayer ceramic capacitor and method for manufacturing same

A multilayer ceramic capacitor contains Ni in internal electrodes, and includes a sintered metal layer containing Cu in external electrodes. At a joined portion between each internal electrode and each external electrode, mutual diffusion layers of Cu and Ni extend across the internal and external electrodes. On each internal electrode, a mutual diffusion layer is present with a thickness t, which is defined by a dimension from a first end surface or a second end surface to an interior end in a longitudinal direction, not smaller than about 0.5 &#x3bc;m and not greater than about 5 &#x3bc;m. On each external electrode, a mutual diffusion layer is present with a thickness t, which is defined by a dimension from the first end surface or the second end surface to an exterior end in the longitudinal direction, not smaller than about 2.5% and not greater than about 33.3% of a thickness tof a sintered metal layer.

Multilayer ceramic capacitor and method for manufacturing the same

A multilayer ceramic capacitor that contains at least one kind of a first element that forms a covalent hydride with hydrogen (except for an element generating a hydride having a boiling point of less than 125&#xb0; C.) and a second element that forms a hydride in a boundary region with hydrogen between an outermost plating layer constituting an external electrode and a dielectric layer constituting a ceramic element body.

Multilayer ceramic capacitor

A multilayer ceramic electronic component that has a multilayer portion having an outer layer portion adjacent region including an area in contact with an outer layer portion that forms a thermal-shock absorbing portion that includes curved ceramic layers and inner electrode layers smoothly varying in thickness from point to point. A region to an inside of the thermal-shock absorbing portion forms a normal multilayer portion that includes ceramic layers with less curvature than the ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in a direction along a principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion.

Multilayer ceramic electronic component

In a monolithic ceramic capacitor, ceramic layers defining inner layers are mainly composed of a perovskite compound containing Ba and Ti. A portion of an electrically effective section in the ceramic layers near a connecting portion between the inner electrodes and an outer electrode undergoes mapping analysis by an energy-dispersive method. In regions of the resulting mapping image, the regions extending from the interfaces between the inner electrodes and a corresponding one of the ceramic layers to positions about &#x2153; of the thickness of the ceramic layer in the stacking direction, ((L2&#x2212;L3)/L1)&#xd7;100&#x2267;50 is satisfied, where L1 represents the total length of grain boundaries, L2 represents the total length of grain boundaries where a rare-earth element is present, and L3 represents the total length of portions where the grain boundaries where the rare-earth element is present are overlapped with grain boundaries with a specific element present.

Monolithic ceramic capacitor containing perovskite compound

In a multilayer ceramic capacitor, an inner ceramic layer includes a perovskite-type compound containing Ba and Ti. A region within an electrically effective portion of the inner ceramic layers sandwiched between inner electrodes, which is near an area where inner and outer electrodes connect to each other, is subjected to a mapping analysis using EDS. ((L&#x2212;L)/L)&#xd7;100&#x2267;50 is satisfied, Ldenotes a total length of ceramic grain boundaries detected from a TEM transmission image, Ldenotes a total length of grain boundaries, detected from a mapping image and the TEM transmission image, where the rare earth element is present, and Ldenotes a total length of portions, detected from a mapping image and the TEM transmission image, in which the grain boundaries where the rare earth element is present and grain boundaries where at least one of Mn, Mg, and Si is present are overlapped.

Multilayer ceramic capacitor having high moisture resistance

A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40&#xb0; C./second or more.

Laminated ceramic electronic component and manufacturing method therefor

A laminated ceramic capacitor including a laminated body having a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The internal electrodes have a plurality of ceramic columnar members formed therein, which project into the internal electrodes from interfaces between the ceramic layers and the internal electrodes, but do not penetrate in the thickness direction of the internal electrodes.

Changes in states giving rise to electrode breakage and ball formation are made less likely during firing step for sintering the laminated body, and the improvement in DC bias characteristics is achieved in laminated ceramic electronic components with a laminated body which has internal electrodes, even when ceramic layers and the internal electrodes are reduced in thickness. The laminated body is divided into a large grain region in which the ceramic has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter. The large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which the internal electrodes are present in the laminated body. In order to obtain the laminated body, a heat treatment is carried out in the firing step with a temperature profile in which the average rate of temperature increase from room temperature to the maximum temperature is 40&#xb0; C./second or more.

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Nagaokakyo, Japan

Yoshito Saito