Okuno Chemical Industries Co., Ltd.

Mitsuboshi Belting Ltd.

Yoshito Nokami

Yoshio Yamaguchi

Toru Noguchi

Masahito Kawahara

Yoshifumi Yamashita

Shigehiro Sanichi

The present invention provides a ceramic color composition which comprises, as a solid powder, 50 to 90 wt. % of a mixture containing 5 to 95 parts by weight of a first lead-free glass powder comprising at least SiO, ZnO, and BOas glass components, and 5 to 95 parts by weight of a second lead-free glass powder comprising at least SiO, BiO, and BOas glass components, 10 to 40 wt. % of an inorganic pigment, and 0 to 10 wt. % of an inorganic filler. The composition is free of lead and exhibits an excellent mold release property during the heat-molding process of a glass plate having the composition printed thereon. After firing, the composition is excellent in acid resistance, coloration in the bus bar portion, and plating resistance.

Ceramic color composition and method for bending flat glass

A conductor paste comprising a high-polymer composite obtained by dispersing super-fine-granulated copper oxide in a polymer without being aggregated, mixed copper powders mainly composed of a base copper powder having a mean particle size of 1 to 10 .mu.m added with at least one kind of an auxiliary copper powder having a mean particle size smaller than that of the base copper powder, and an organic solvent, wherein the weight ratio of the mixed copper powders to copper oxide in the high-polymer composite is 5 to 50 to 1 of copper oxide and the total amount of copper oxide and the mixed copper powders is 50 to 90% by weight of the conductor paste, and a production method a conductor film by coating the conductor paste on the surface of a substrate and after pre-burning the conductor paste under temperature raising, burning the conductor paste to form the conductor film on the substrate.

Copper conductor paste and production method of copper conductor film

A conductor paste comprising a high-polymer composite obtained by dispersing super-fine-granulated copper oxide in a polymer without being aggregated, mixed copper powders mainly composed of a base copper powder having a mean particle size of 1 to 10 .mu.m added with at least one kind of an auxiliary copper powder having a mean particle size smaller than that of the base copper powder, and an organic solvent, wherein the wight ratio of the mixed copper powders to copper oxide in the high-polymer composite is 5 to 50 to 1 of copper oxide and the total amount of copper oxide and the mixed copper powders is 50 to 90% by weight of the conductor paste, and a production method a conductor film by coating the conductor paste on the surface of a substrate and after pre-burning the conductor paste under temperature raising, burning the conductor paste to form the conductor film on the substrate.

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Wakayama, Japan

Yoshito Nokami