Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Yoshito Kitagawa

Toshiyuki Asahi

Naoyuki Tani

Takashi Matsuda

Kiyotaka Komori

Mitsuyoshi Nishino

Akiyoshi Nozue

Takayuki Suzue

A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D) of 2 to 15 &#x3bc;m and (B) magnesium oxide having an average particle diameter (D) of 0.5 to 15 &#x3bc;m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

Prepreg, laminate, metal foil-clad laminate, circuit board and LED module

A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.

Printed wiring board, build-up multi-layer board, and production method therefor

Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D) of 2 to 15 &#x3bc;m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D) of 2 to 15 &#x3bc;m and inorganic particles that have an average particle diameter (D) of 2 to 15 &#x3bc;m and that contain crystal water having a release initiation temperature of 400&#xb0; C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D) of 1.5 &#x3bc;m or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting

Growing community of inventors

Osaka, Japan

Yoshito Kitagawa