Hitachi High-Tech Corporation

Hitachi-High-Technologies Corporation

Yoshito Kamaji

Masahiro Sumiya

Shota Umeda

Kenji Tamaki

Junya Sasaki

Takahiro Yonemoto

A diagnosis device that uses information from state sensors provided in a plasma processing apparatus for plasma processing a specimen to diagnose deterioration states of components configuring the plasma processing apparatus includes an execution unit that computes and calculates deterioration degree of each of the components configuring the plasma processing apparatus on the basis of the information from the state sensors, and an analysis unit that sets a computation condition for computing and calculating the deterioration degree by the execution unit on the basis of the information from the state sensors and calculates a maintenance period of the plasma processing apparatus on the basis of the information of the deterioration degree of each of the components configuring the plasma processing apparatus computed and calculated by the execution unit, and makes it possible to decide deterioration degree computation condition having high robustness for each of the components.

Diagnosis device, diagnosis method, plasma processing apparatus, and semiconductor device manufacturing system

In a plasma processing apparatus, occurrence of unplanned maintenance is predicted in advance so that a time when the work should be incorporated into planned maintenance can be determined. An apparatus diagnostic apparatus including a degradation score estimation unit that receives an output of a sensor mounted on a plasma processing apparatus and estimates a degradation score of the plasma processing device; a maintenance work occurrence probability estimation unit that calculates a probability of occurrence of an unplanned maintenance work that is not included in an original maintenance plan based on the degradation score; an actual maintenance cost calculation unit that calculates an actual maintenance cost; and a plan incorporated maintenance cost calculation unit that outputs a correction plan of maintenance plan in which the original maintenance plan is corrected by incorporating the unplanned maintenance work based on the probability of occurrence of the unplanned maintenance work.

Apparatus diagnostic apparatus, apparatus diagnostic method, plasma processing apparatus and semiconductor device manufacturing system

A system that predicts an apparatus state of a plasma processing apparatus including a processing chamber in which a sample is processed is configured to have a data recording unit that records emission data of plasma during processing of the sample and electrical signal data obtained from the apparatus during the plasma processing, an arithmetic unit that includes a first calculation unit for calculating a first soundness index value of the plasma processing apparatus and a first threshold for an abnormality determination using a first algorithm with respect to the recorded emission data and a second calculation unit for calculating a second soundness index value of the plasma processing apparatus and a second threshold for the abnormality determination using a second algorithm with respect to the electrical signal data recorded in the data recording unit, and a determination unit that determines soundness of the plasma processing apparatus using the calculated first soundness index value and the first threshold and the calculated second soundness index value and the second threshold.

Plasma processing apparatus and prediction method of the condition of plasma processing apparatus

A plasma processing apparatus including a state prediction apparatus that predicts an apparatus state of the plasma processing apparatus configured to include an apparatus data recording unit that records apparatus data output from the plasma processing apparatus during the processing of the sample, a physical environment measurement data recording unit that measures physical environment in the processing chamber and records apparatus physical environment data, data correction unit that extracts a temporal change component of the physical environment from a plurality of the apparatus physical environment data recorded in the physical environment measurement data recording unit and extracts the temporal change component of the physical environment from the apparatus data to remove the temporal change components, and an apparatus state prediction calculation unit that predicts the state of the plasma processing apparatus using the apparatus data from which the temporal change component of the physical environment is removed as input data.

Plasma processing apparatus and prediction apparatus of the condition of plasma processing apparatus

A plasma processing method includes forming a deposition film containing silicon as a component in a processing chamber by generating a first plasma in the processing chamber; plasma etching of a sample in which a film containing a metal is formed in the processing chamber; and removing of a metal-based reaction product by generating a second plasma including an element having reducibility and halogen. The plasma processing method further includes removing the deposition film by a third plasma generated by using gas containing a fluorine element; and removing residual gas by a fourth plasma.

Growing community of inventors

Tokyo, Japan

Yoshito Kamaji