Asahi Kasei Kabushiki Kaisha

Yoshito Ido

Tomohiro Yorisue

Taihei Inoue

Harumi Matsuda

Takahiro Sasaki

Mitsutaka Nakamura

Tomoshige Yunokuchi

Daisuke Sasano

A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150&#xb0; C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4'-oxydiphthalic acid dianhydride and a structure derived from 4,4&#x2032;-diaminodiphenyl ether; or (ii) a structure derived from 3,3&#x2032;4,4&#x2032;-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4&#x2032;-diaminodiphenyl ether; or (iii) a structure derived from 4,4&#x2032;-oxydiphthalic acid dianhydride and a structure derived from 2,2&#x2032;-dimethyl-4,4&#x2032;-diaminobiphenyl.

Photosensitive resin composition, polyimide production method, and semiconductor device

A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus

A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of Rto Rindependently represents a hydrogen atom or a monovalent organic group).

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Tokyo, Japan

Yoshito Ido