Hitachi, Ltd.

Yoshito Hayashi

Tamotsu Tsukaguchi

Takahiro Daikoku

Toshiyuki Utsuki

Toshio Hatada

Fumiyuki Kobayashi

Takashi Yamamoto

Kenichi Kasai

Kenta Kumagai

Takayuki Atarashi

Toshiki Iino

Fumio Kishida

Nobuo Kawasaki

Tohru Higashihara

Masakatsu Tanji

The circuit board packaging structure capable of inserting and extracting an interface part of a circuit board into and from a connector part of the processing equipment in a direction different from a direction of attaching and detaching the circuit board to and from the processing equipment includes: an operating part which turns on receiving force; a plate part which is fixed to the circuit board to be rotatable in a direction reverse to a turning direction of the operating part, and converts the force received by the operating part to force in a direction different from the attaching and detaching direction to move the circuit board in that direction; a link part which connects the operating part with the plate part to transmit the force received by the operating part to the plate part; and a fastener which fastens the circuit board and the operating part with play.

Circuit board packaging structure

Computer

An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

Electronic apparatus

Growing community of inventors

Atsugi, Japan

Yoshito Hayashi