Sekisui Chemical Co., Ltd.

Yoshito Arai

Yasunari Kusaka

Nami Nakajima

Ryota Yamasugi

Noriyuki Uchida

Mitsuo Matsumoto

Tomohiro Horinouchi

Yudai Ogata

Aya Adachi

Isao Higuchi

Kazuto Nakamura

The present invention aims to provide a resin composition for molding that makes it possible to achieve excellent continuous productivity and to produce a molded article having high surface smoothness, capable of reducing defective molding, less likely to crack during use, and also having excellent shock resistance. The present invention also aims to provide a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; and a melt additive, the resin composition containing three components including a Acomponent, a Bcomponent, and a Ccomponent, and having a percentage of the Ccomponent [Ccomponent/(Acomponent+Bcomponent+Ccomponent)] of 30% or less, the three components being identified by measuring the resin composition by a solid echo method using pulse NMR at 100° C. to give a free induction decay curve ofH spin-spin relaxation, and subjecting the free induction decay curve to waveform separation into three curves derived from the Acomponent, the Bcomponent, and the Ccomponent in order of shorter relaxation time using the least square method.

Molding resin composition and molded article

The present invention provides a polyvinyl acetal resin which leaves less fine undissolved matter when dissolved in an organic solvent and thus can improve productivity particularly when used as a binder for a ceramic green sheet, and which can also provide a ceramic green sheet having excellent toughness and enables production of a highly reliable multilayer ceramic capacitor. Provided is a polyvinyl acetal resin having: a wavenumber A (cm) of a peak within a range of 3,100 to 3,700 cmin an IR absorption spectrum measured using an infrared spectrophotometer; and a hydroxy group content (mol %), the wavenumber A of the peak and the hydroxy group content satisfying relations of the following formulas (1) and (2):[(3,470−)/Hydroxy group content]≤5.5  (1)(3,470−)≤185  (2)wherein A is a wavenumber which is lower than 3,470 cmand at which a transmittance a (%) satisfying [100−(100−X)/2] is exhibited, where X (%) is a minimum transmittance of the peak within the wavenumber range of 3,100 to 3,700 cm.

Polyvinyl acetal resin

The present invention provides a resin composition for molding having excellent thermal meltability and capable of providing a molded article that is less likely to crack from a resin weld during use and has excellent surface gloss, and a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; a polyvinyl chloride resin; and a melt additive, the resin composition having an area ratio of a peak B observed in a range of 0.6 to 1.0 ppm to a peak A observed in a range of 9.5 to 10 ppm (Area of peak B/Area of peak A) of 1 to 1,000 when aH NMR spectrum is measured by solution NMR.

Resin composition for molding and molded article

The present invention aims to provide an adhesive tape capable of exhibiting excellent adhesion to rough surfaces. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing an acrylic copolymer, the acrylic copolymer containing 30% by weight or more of a structural unit derived from n-heptyl (meth)acrylate and 0.01% by weight or more and 30% by weight or less of a structural unit derived from 1-methylheptyl (meth)acrylate.

Adhesive tape, method for immobilizing electronic device component or on-vehicle device component, method for manufacturing electronic device or on-vehicle device

The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.01 parts by weight or more and 10 parts by weight or less of a compound having a structure represented by the following formula (A) or (B) relative to 100 parts by weight of the acrylic copolymer:

Adhesive tape, method for fixing electronic device component or on-board device component, and method for producing electronic device or on-board device

Growing community of inventors

Osaka, Japan

Yoshito Arai