Toppan Printing Co., Ltd.

Yoshito Akutagawa

Osamu Koga

Yasuyuki Hitsuoka

Akane Kobayashi

A glass core device with a wiring pattern on a first surface of a glass core and a wiring pattern on a second surface thereof being electrically connected via a wiring pattern embedded in TGVs formed in the glass core. In a state of being cut out by dicing, each glass core has a second surface and side faces which are continuously covered with an outer protective layer.

Glass core device and method of producing the same

A wiring substrate used for improvement in manufacturing efficiency of a semiconductor device includes a support body having transparency; an adhesive layer disposed on a main surface of the support body, the adhesive layer including a peeling layer which contains a third resin which is decomposed by light irradiation and a protective layer which is disposed on the peeling layer and contains a fourth resin; and a laminate disposed on the adhesive layer, the laminate including a first resin layer, a second resin layer disposed on the first resin layer, and a wiring pattern disposed at least between the first resin layer and the second resin layer. Accordingly, the semiconductor chip and the wiring substrate which is the external connection member can be separately manufactured, thereby improving manufacturing efficiency of the semiconductor device.

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Tokyo, Japan

Yoshito Akutagawa