Fujitsu Corporation

Yoshiteru Ochi

Nobutaka Itoh

Makoto Sakairi

Hidehisa Sakai

Yoko Kobayashi

Mami Nakadate

Akiyoshi Saitou

A cooling system includes a heat exchanger provided on a heat generating component, the heat exchanger having a size larger than the heat generating component, a leaf spring to extend from a first side of an upper surface of the heat exchanger to a second side opposite to the first side, and be fixed to the upper surface of the heat exchanger, a first screw to be arranged around the heat exchanger, and to fix the leaf spring to a printed circuit board, and a convex portion to be raised to be higher than a first portion of the first side and a second portion of the second side, and to be formed at a central portion between first and second portions within a region of the upper surface of the heat exchanger that overlaps with the leaf spring.

Cooling system

A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.

Bonding model generation apparatus and bonding model generation method

An electronic device includes, a circuit board including a through hole, a member including a screw hole, a screw including a screw body having an outer diameter smaller than an inner diameter of the through hole and a screw head having an outer diameter larger than the inner diameter of the through hole, wherein the screw body penetrates through the through hole to engage with the screw hole and the screw head is disposed on an opposite side of the circuit board to the member, and a first washer provided between the screw head and the circuit board, the first washer including a first washer body and a plurality of first washer legs extending from the first washer body toward the circuit board, the first washer legs being in contact with the circuit board and having a characteristic of reducing stress on the circuit board upon being heated.

Electronic device, washer and method for manufacturing washer

A connector includes a contact pin in which a free end projecting from a supporting member comes into contact with an electrode of a first object and a second object, and a bending part is provided onto a base end such that the connector has an inclination against the first object and the second object. The rigidity of the bending parts is selectively set to be high by selectively increasing a thickness of the bending part.

Connector, electronic device, and method of manufacturing electronic device

When reliability evaluation of the whole electronic package is performed, the time required for simulation is decreased, while solder connection parts, in particular, are accurately analyzed. The whole analysis model creating unit creates a solder connection part model which has the same volume, height, and connection area as the volume, height, and connection area of the solder connection part. By means of dividing the solder connection model into multiple meshes, the first mesh data for use in electronic package analysis is created.

Electronic package evaluation apparatus, electronic package optimizing apparatus, and computer-readable recording medium in which electronic package evaluation program is recorded

A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0&#x3c;L(L/3) is set, where Ldenotes the distance between center positions of a pair of neighboring via forming parts formed in the same insulation layer and Ldenotes the shortest separation distance between the pair of the via forming parts.

Growing community of inventors

Kawasaki, Japan

Yoshiteru Ochi