Denso Corporation

Yoshitaro Yazaki

Toshikazu Harada

Yoshihiko Shiraishi

Toshihiro Miyake

Tomohiro Yokochi

Toshihisa Taniguchi

Atusi Sakaida

Keita Saitou

Yasuhiro Tanaka

Norio Gouko

Koji Kondo

Makoto Totani

Motoki Shimizu

Eijirou Miyagawa

Takehito Teramae

Kazuyuki Deguchi

Hajime Nakagawa

Kazuya Sanada

Yasutaka Kamiya

Katsuaki Kojima

Gentaro Masuda

Hideharu Ishihara

Tetsuaki Kamiya

Ryuichi Onoda

Koichi Shigematsu

Satoshi Takeuchi

Masayuki Aoyama

Mitsutoshi Miyazaki

Kazuo Tada

Yosuke Ozaki

Tomoyuki Nanami

Hiroyasu Iwama

Akinari Higashida

Katsumi Yamazaki

Hiroshi Nagasaka

Kenzo Hirano

Hiroki Miyagawa

Hiroaki Maeda

Seiichi Shindou

Seiji Konishi

A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.

Biological object detector, vehicle seat occupancy detector, and seat belt non-wearing warning system

A non-contact power supply control system includes: an electric transmission pad connected to a power source unit; a control unit controlling current supply to the electric transmission pad; a living body detecting means detecting a living body present around the electric transmission pad; a power receiving pad magnetically coupled to the electric transmission pad to excite power, when current is supplied from the power source unit to the electric transmission pad; and a power storage unit storing power excited by the power receiving pad. The living body detecting means are arranged on the road surface side, and the control unit, when determining that no living body is present around the electric transmission pad on the basis of a result from the living body detecting means, controls the power supply unit to supply power to the power storage unit.

Non-contact power supply control system for controlling power supply by living body detection

A liquid level detector includes: a detecting element having one surface and the other surface opposite to the one surface, the one surface being opposed to a liquid, while being parallel to a height direction of liquid level; a Peltier element provided on the other surface side of the detecting element; and a control unit performing a detection processing for a liquid level of the liquid. The Peltier element forms a heat flow passing through the detecting element from the other surface to the one surface, toward the liquid or a gas. The control unit calculates a liquid level on the basis of an output value of an electrical signal outputted according to the heat flow passing through the detecting element, and a relationship between an output value of the detecting element and a liquid level.

Liquid level detector for open vessel and closed vessel

A heat quantity control device has a heat flux sensor arranged between first and second heating elements arranged adjacently to each other, and a control section for controlling a heat quantity of the first and second heating elements. The heat flux sensor has an insulation board made of thermoplastic resin, first and second via holes formed in the insulation board penetrating in a thickness direction thereof. First and second layer connection members are embedded in the first and second via holes, respectively. The first and second layer connection members are made of different metals and alternately connected in series. The control section controls a heat quantity generated in the first and second heating elements based on the electromotive force generated in the heat flux sensors so that a heat flux flowing between the first and second heating elements becomes not more than a predetermined value.

Heat quantity control device

There is provided a heat flux sensor with first and second interlayer connection members composed of different metals from each other of which metal atoms maintain a predetermined crystal structure embedded in first and second via holes of a thermoplastic resin made insulating substrate, the first and the second interlayer connection members are connected in series alternately, and a control unit that performs abnormality determination of a heating element disposed in a vehicle. The heat flux sensor is provided to the heating element and outputs a sensor signal corresponding to heat flux between the heating element and an outside air, and the control unit determines based on the sensor signal that there is abnormality in the heating element when the heat flux between the heating element and the outside air is out of a predetermined range.

Abnormality determination apparatus for vehicle

An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.

Manufacturing method for thermoelectric conversion device

A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board

A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.

Method for connecting printed circuit boards and connected printed circuit boards

An inspection apparatus for a base substrate of a multi-layered board irradiates light to the base substrate of a multilayered board to which a protective film is attached. An image of a surface, to which the protective film is attached, is picturized by a camera, so that an acceptability of a state of a via hole is inspected on the basis of a difference between a light reflectivity of the via hole and a light reflectivity of the protective film. The protective film is colored so as to lower its light reflectivity so that the difference between the light reflectivity of the via hole and that of the protective film is clearly generated. Accordingly, on the basis of the image picturized by the camera, the size of the via hole, dusts therein and the acceptability of the via hole can be accurately inspected.

Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates

A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

Method of manufacturing a printed wiring board

Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Connecting structure of printed circuit boards

Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.

Manufacturing method of multilayer substrate

An interconnection structure has a first printed circuit board including an insulating substrate made of a thermoplastic resin and a first board conductive pattern with a land, a second printed circuit board overlapped with the first printed circuit board, and including a second board conductive pattern with a land that is electrically interconnected with the land of the first printed circuit board to form an interconnection portion between the first board conductive pattern and the second board conductive pattern. A part of the thermoplastic resin constituting the insulating substrate of the first printed circuit board extends to seal the interconnection portion. The insulating substrate of the first printed circuit board is adhered to an insulating substrate of the second printed circuit through an adhesion enhancing layer in which a material for lowering a modulus of elasticity of the insulating substrate of the first printed circuit board is dispersed therein.

Interconnection structure for interconnecting printed circuit boards

The invention provides metal connecting composition for connecting metal to metal with removing oxide film on the mother metal surface. The metal connecting composition contains metal particles and hydrocarbon compound having C&mdash;H bonding dissociation energy of a value equal to or lower than 950 KJ/mol. When metal pieces between which the metal connecting composition is applied is heated, the hydrocarbon compound is dehydrogenated to form radical, and the radical reduces oxide film on the metal surface to be connected.

Growing community of inventors

Anjo, Japan

Yoshitaro Yazaki