Nitta Haas Inc.

Yoshitane Shigeta

Jaehong Park

Kouichi Yoshida

Masaharu Kinoshita

Shinichi Matsumura

The present invention provides a polishing pad which can improve qualities of an object to be polished by improving the flatness of the object. A polishing surfaceof a polishing padis subjected to a mechanical process, such as buffing, so that the flatness of the surface is improved, and corrugations on the polishing surface have a cycle of 5 mm-200 mm and a largest amplitude of 40 &#x3bc;m or less. As a result, the flatness of the object polished by the polishing pad, such as a silicon wafer, is improved.

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Kyoto, Japan

Yoshitane Shigeta