Murata Manufacturing Co., Ltd.

Yoshitake Yamagami

Takahiro Oka

Hiromichi Kawakami

Kazuo Kishida

Yuki Takemori

Takahiro Sumi

A ceramic wiring board that includes a ceramic insulator and a via-conductor. The ceramic insulator includes a crystalline constituent and an amorphous constituent. The via-conductor includes a metal and an oxide. The crystalline constituent and the oxide include at least one metal element in common. A tubular region having a thickness of 5 &#x3bc;m adjoins and surrounds the via-conductor and has a higher concentration of the metal element than the ceramic insulator.

Ceramic wiring board and method for producing the same

A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1&#x3e;X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

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Nagaokakyo, Japan

Yoshitake Yamagami