Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Yoshitake Hayashi

Masayoshi Koyama

Kazuo Otani

Seiichi Nakatani

Hiroshi Yamaguchi

Osamu Shibata

Yoshihiro Tomura

Toshiyuki Kojima

Suzushi Kimura

Satoru Yuhaku

Minoru Yamamoto

Shozo Ochi

Yasushi Taniguchi

Ryuichi Saito

Susumu Matsuoka

Satoru Yuuhaku

Yoshitaka Sunagawa

Hideo Kanzawa

Hikofumi Oido

Kazuo Ohtani

Yosuke Maeba

A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

Component built-in module, and manufacturing method for component built-in module

Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

Multilayer circuit board and manufacturing method thereof

A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Method for manufacturing component built-in module, and component built-in module

A method of manufacturing a circuit board by forming a circuit pattern in a short process and capable of performing pattern transfer with stability. The manufacturing method includes a step of superposing on a carrier a resist layer in which a circuit pattern is formed and which is formed of a conductor or an insulator, a step of filling the circuit pattern with an electroconductive material, a step of removing the resist layer from the carrier, and a step of transferring the electroconductive material filled in the circuit pattern into an electrical insulating material.

Method of manufacturing circuit board and communication appliance

Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body

A gyro which realizes a small error response to a disturbance inertia such as vibration, impact, etc. and an adjusting system thereof has a pair of mass elements which are cyclically driven symmetrically. A pair of sensors independently detect forces produced in response to an input angular rate and generate a pair of detection outputs. An adjustable adder synthesizes components proportional to the disturbance inertia contained in the detection outputs with an optimum addition ratio so that they are mutually completely cancelled and generates a synthesized output. A signal processing circuit processes the synthesized output to generate an output proportional to the input angular rate. The adjusting system applies to the gyro in an operating condition a disturbance vibration in the vicinity of the drive frequency of the gyro. By adjusting the addition ratio of the adjustable adder in a manner so as to make the response at this time a minimum, the best characteristic can be obtained.

Cyclically driven gyro and adjusting system therefor

A package configuration of a solar cell has a glass substrate having a solar cell element formed on the surface opposite to the light-receiving surface thereof, a backplate disposed across an empty space from the surface of the glass substrate opposite to the light receiving surface thereof, a frame connecting the glass substrate and the backplate to each other along the peripheries thereof, a sealing resin layer sealed inside the peripheries of the backplate and the frame so as to isolate the empty space from the atmosphere, a layer of desiccant disposed inside the backplate so as to adsorb moisture penetrating into the empty space, and conductor wires for externally collecting electric energy generated by the solar cell element.

Package configuration of solar cell elements

Growing community of inventors

Osaka, Japan

Yoshitake Hayashi