Ngk Spark Plug Company, Limited

Yoshitaka Yoshida

Hiroaki Yamamoto

Kazushige Akita

Takatoshi Tojo

Hiroyuki Takahashi

Naoki Kito

Shigeru Taga

Masahiro Ogawa

Takashi Kurauchi

Jun Suzuki

Shinji Suzumura

A wiring substrate includes: a substrate body made of ceramic and having a front surface and a rear surface, each having a rectangular shape in a plan view, a plurality of rear surface electrodes formed on the rear surface of the substrate body, a frame-shaped conductive portion provided on the front surface side of the substrate body, and a via conductor penetrating the substrate body and establishing electric connection between the plurality of rear surface electrodes and the frame-shaped conductive portion. A part of the rear surface is exposed between the plurality of rear surface electrodes and each side of the rear surface of the substrate body. On the rear surface of the substrate body, at least one projecting wiring is formed between each of the plurality of rear surface electrodes and each of a corresponding pair of the sides that intersect with each other.

Wiring substrate and multi-piece wiring substrate

A ceramic package includes a package main body which is formed of a ceramic material, which has a front surface and a back surface having a rectangular shape in plan view, and which has a cavity opening toward the front surface; a first metalized layer which has a frame shape in plan view and is formed on the front surface; and a second metalized layer which is formed on the front surface of the first metalized layer so as to assume a frame shape, and which has a width smaller than the width of the first metalized layer, wherein the width of the second metalized layer at each corner portion of the front surface in plan view is smaller than the width of the second metalized layer in a region other than the corner portion in plan view.

Ceramic package

A multi-piece-array formed by laminating a plurality of ceramic layers includes: a product region where a plurality of wiring board portions having a rectangular shape in plan view and including cavities are arranged in matrix; a redundant portion that is positioned along a periphery of the product region; and dividing grooves that are formed on a front surface and/or a back surface along a boundary between the wiring board portions and a boundary between the wiring board portion and the redundant portion. A deepest portion of the dividing groove has an arc shape and the dividing groove includes a middle portion, and a width of the deepest portion is greater than a width of the groove inlet and a width of the middle portion is equal to or less than the width of the groove inlet.

Multi-piece-array and method of manufacturing the same

A ceramic substrate includes a substrate body formed of ceramic and having a pair of surfaces each assuming a rectangular shape as viewed in plane, and a metallization layer formed on the surface of the substrate body and adapted to braze a metal frame thereon. A composite material layer is disposed between the surface of the substrate body and the metallization layer and is formed such that a ceramic portion, a metal portionformed of a metal similar to a metal component of the metallization layer or a metal which, together with a metal component of the metallization layer, forms an all proportional solid solution, and a glass portion exist together. The thickness of the composite material layer is thinner than that of the metallization layer. A plating layer is deposited on the surface of the metallization layer.

Ceramic substrate and process for producing same

In the glass-ceramic composition, a weight ratio of a glass and a ceramic is 40 to 60:60 to 40. The glass is composed of 40 to 60 wt % of SiO,, 5 to 9 wt % of Al,O,, 1 to 10 wt % of B,O,, 3 to 5 wt % of Na,O&plus;K,O, 3 to 15 wt % of CaO&plus;MgO&plus;ZnO, and 15 to 40 wt % of PbO, and does not contain Li,O. A softening point of the glass is 650 to 780&deg; C. The circuit substrate includes a laminate substrate formed by laminating insulating substrates, and a conductor circuit formed on a surface of each insulating substrate. The insulating substrate is formed of the glass-ceramic composition. A wiring layer and a via hole conductor are provided inside the laminate substrate.

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Kounan, Japan

Yoshitaka Yoshida