Mitsubishi Gas Chemical Company, Inc.

Yoshitaka Ueno

Michio Yaginuma

Katsuya Yamamoto

Syouichi Itoh

Shoichi Ito

Masataka Kudo

Kazuyuki Higashita

Emi Fukasawa

Saori Honda

A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n- represents a polyphenylene ether moiety; R, R, and Reach independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; nrepresents an integer of from 1 to 100; nrepresents an integer of from 1 to 6; and nrepresents an integer of from 1 to 4.

Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board

A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.

Resin composition, prepreg, resin sheet, and metal foil-clad laminate

A resin composition is provided which can be suitably used in a printed circuit board having excellent electrical properties, heat resistance and peel strength, with flame retardancy maintained, a prepreg and resin sheet which use the same, and a metal foil-clad laminate which uses the prepreg. A resin composition including a polyphenylene ether (A), a specific phosphorus-containing cyanate ester compound (B), a non-halogenated epoxy resin (C), a cyanate ester compound (D) and a filler (E) is used.

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Tokyo, Japan

Yoshitaka Ueno