Other

Yoshitaka Terashima

Satoru Shimizu

Hiroshi Nagasawa

Takashi Miyake

Seiji Iimura

Hideo Honma

Ryoichi Kimizuka

Hideki Hagiwara

Tomoyuki Fujinami

Tsuyoshi Sahoda

Shinji Hayashi

Megumi Maruyama

A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this copper plating bath are disclosed. A copper plating bath capable of providing highly reliable copper plating on a substrate such as a silicone wafer semiconductor substrate or printed board having minute circuit patterns and small holes such as blind via-holes, through-holes, and the like, and a method of copper plating using the copper plating bath can be provided.

Copper plating bath and plating method for substrate using the copper plating bath

An electroless copper plating solution which is based on an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorous acid compound as a reducing agent, and a metallic catalyst for initiating a reductive reaction, as characterized by further comprising a lithium ion or both a lithium ion and a polyoxyethylene type surfactant, and a method for electroless copper plating using the same, as well as a plated product made by such a process. The electroless copper plating solution in the present invention enables a uniform and acicular copper film to be deposited on the surface of a plating object, and therefore can be used for improving the strength of adhesion between various metals and resins, including bonding of a copper foil to a resin as applied in a conductive circuit such as a multi-layer printed circuit board or in a copper-plated laminate.

Electroless copper plating solution and method for electroless copper plating

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Fujisawa, Japan

Yoshitaka Terashima