Denka Company Limited

National Institute for Materials Science

Denki Kagaku Kogyo Kabushiki Kaisha

Hirata Corporation

Yoshitaka Taniguchi

Atsushi Sakai

Go Takeda

Hideki Hirotsuru

Suzuya Yamada

Kohki Ichikawa

Daisuke Goto

Akira Miyai

Akira Hasegawa

Masahide Kaneko

Makoto Watanabe

Toshitaka Yamagata

Takeshi Gotoh

Kentaro Nakayama

Goh Iwamoto

Toshiharu Tanaka

Seiji Kuroda

Kazunori Koyanagi

Isao Sugimoto

Yutaka Hirashima

Nobuyuki Yoshino

Kosuke Wada

Hiroshi Araki

Takemi Oguma

Katsunori Terano

Yasuhito Hushii

Syoji Takakura

Yoshihiko Tujimura

Kiyotaka Fuji

Masaya Yumiba

Michiharu Nakashima

A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 μm or more, the diameter at the second is ⅔ or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.

Heat-conductive resin composition and heat dissipation sheet

To provide a boron nitride powder having excellent heat conductivity and high particle strength. Provided is a boron nitride powder which comprises bulky boron nitride formed such that scaly primary particles of hexagonal boron nitride are aggregated to form bulky particles, and which has the following characteristics (A) to (C):

Boron nitride powder, method for producing same, and heat-dissipating member produced using same

A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

Composite substrate and method for manufacturing same, and circuit substrate and method for manufacturing same

A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 &#x3bc;m or more and 100 &#x3bc;m or less.

Surface-treated aggregated boron nitride powder, aggregated boron nitride powder, and thermally conductive resin composition

A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.

Method for manufacturing aluminum circuit board

A boron nitride powder includes boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 &#x3bc;m or more and 3.5 &#x3bc;m or less and a standard deviation of 1.2 &#x3bc;m or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 &#x3bc;m or more and 100 &#x3bc;m or less. Also provided are a method for producing the same and a thermally conductive resin composition including the same.

Boron nitride aggregated grain

A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10&#xb0; C. to 270&#xb0; C. and then ejected from the nozzleand a gauge pressure of the inert gas at an inlet of the nozzleis from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like.

Method for producing ceramic circuit board

A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value &#x3b1;1 of a linear thermal expansion coefficient at 25&#xb0; C. to 150&#xb0; C. is 5&#xd7;10to 9&#xd7;10/K, a ratio &#x3b1;1/&#x3b1;2 of the &#x3b1;1 to a theoretical value &#x3b1;2 of the linear thermal expansion coefficient at 25&#xb0; C. to 150&#xb0; C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.

Ceramic circuit board

A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient &#x3b1;1 (&#xd7;10/K) of the base plate and a linear thermal expansion coefficient &#x3b1;2 (&#xd7;10/K) of the ceramic insulating substrate when a temperature decreases in the range of 25&#xb0; C. to 150&#xb0; C. satisfy the following Expression (1). 

Power module

The present invention provides a spherical boron nitride fine powder and the other superior in filling property into resin. The present invention relates to a spherical boron nitride fine powder having the following characteristics (A) to (C):

Spherical boron nitride fine powder, method for manufacturing same and thermally conductive resin composition using same

To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 &#x3bc;m and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.

Aluminium-silicon carbide composite, and power-module base plate

An assembly-target-object-and-assembly-component carrier pallet carries thereon a target object (semi-finished product)and a plurality of assembly components arranged, as viewed in plane, on a straight line which passes through a predetermined attachment position on the target object where the predetermined assembly component is to be attached. This allows a minimum of moving parts in the attaching device which attaches the assembly components to the assembly target object. Therefore, the structure of an assembling apparatus is simplified and mechanical errors and assembly time are reduced, thereby improving assembling accuracy.

Apparatus for assembling components on a target object utilizing a slider for movement of a pallet

A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a layer comprising Al and Cu.

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Omuta, Japan

Yoshitaka Taniguchi