Hitachi, Ltd.

Showa Denko Materials Co., Ltd.

Hitachi Chemical Company, Ltd.

Resonac Corporation

Sumitomo Chemical Company, Limited

Rohm Co., Ltd.

Pioneer Corporation

Mitsubishi Chemical Corporation

Renesas Electronics Corporation

Renesas Technology Corp.

The University of Tokyo

Kyoto University

Hitachi-Omron Terminal Solutions, Corporation

Yoshitaka Takezawa

Naoki Maruyama

Kazumasa Fukuda

Tomoko Higashiuchi

Yuka Yoshida

Hideyuki Katagi

Shingo Tanaka

Haruaki Sue

Shinichi Kosugi

Yuki Nakamura

Kenji Tanaka

Hiroyuki Takahashi

Yuzo Ito

Tomoo Nishiyama

Kazuya Kiguchi

Fusao Hojo

Hideki Miyazaki

Kinya Nakatsu

Akira Nagai

Hiromichi Suzuki

Shinya Tanaka

Hiroshi Hozoji

Toshiaki Ishii

Takashi Kurihara

Takao Miwa

Fujio Ito

Toshiyuki Miyadera

Junpei Kusukawa

Hiroyuki Yano

Junichi Katagiri

Akihiko Kameoka

Tohru Maruno

Mitsunari Kano

Keishin Handa

Toshiro Uemura

Masaya Nogi

Eiji Mizuno

Masaki Akatsuka

Shin-ichiro Iwamoto

Keiichiro Nishimura

Tomohiro Ikeda

Masahiro Nomura

Takaya Yamamoto

Toshiaki Nakamura

Hiroyuki Kagawa

Shuichi Ohara

Noriaki Taketani

Hisashi Morooka

Masato Shimura

Ikushi Kano

Tohru Matsuura

Junji Sugiyama

Nobutatsu Koshoubu

Shigekatsu Sato

Yoshihiro Amano

Naoki Hara

Lin Tian

Yoshikiyo Kashiwamura

Kei Tougasaki

Shihui Song

Jun'ichi Katagiri

Hiroshi Shoji

Kenichi Ootaka

Seikich Tanno

Mitsunari c/o Hitachi Systems&Services Ltd Kano

An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material

(1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and (2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20° C./minute.

Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicle

An aspect of the present invention is an anisotropic thermal conductive resin fiber including a stretch fiber of a thermoplastic resin; and a thermal insulation material covering the stretch fiber.

Anisotropic thermal conductive resin fiber, anisotropic thermal conductive resin member, and manufacturing method of these

An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa·mor more, and a glass transition temperature of 150° C. or higher.

An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Cured epoxy resin material, epoxy resin composition, molded article, and composite material

Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board

An aspect of the present invention is an anisotropic thermal conductive resin member including a plurality of bundled thermoplastic resin stretch fibers.

Anisotropic thermal conductive resin member and manufacturing method thereof

An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each Rindependently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. 

Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing

An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.

An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of &#x3b7;'2/&#x3b7;&#x2032;1 equal to 3 or less, wherein &#x3b7;&#x2032;1 is an initial dynamic shear viscosity (Pa&#xb7;s) and &#x3b7;&#x2032;2 is a maximum value of dynamic shear viscosity (Pa&#xb7;s), in a measurement of dynamic shear viscosity.

An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound

An epoxy resin composition that comprises an epoxy resin and a curing agent, the epoxy resin comprising an epoxy compound that has, in one molecule, two or more structural units represented by the following Formula (I) and two or more epoxy groups, and the curing agent comprising a compound having two or more amino groups that are directly bound to an aromatic ring. 

Epoxy resin composition, cured product and composite material

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Tokyo, Japan

Yoshitaka Takezawa