Ngk Insulators, Inc.

Yoshitaka Tabuchi

Keisuke Kimura

Tadashi Otagiri

Tomio Suzuki

Hisayoshi Nonaka

Jun Inoue

Michio Suzuki

A honeycomb structure including a plurality of porous honeycomb block bodies bound via joining material layers A. Each of the porous honeycomb block bodies includes a plurality of porous honeycomb segments bound via joining material layers B, each of the porous honeycomb segment includes: partition walls that defines a plurality of cells to form flow paths for a fluid, each of cells extending from an inflow end face that is an end face on a fluid inflow side to an outflow end face that is an end face on a fluid outflow side; and an outer peripheral wall located at the outermost periphery. At least a part of the joining material layers A has higher toughness than that of the joining material layers B.

Honeycomb structure and method for producing honeycomb structure

There is provided a substrate material for wiring having an excellent thermal resistance, and durability and reliability under severe conditions, characterized in that said substrate material comprises an insulator whose major component is composed of epoxy resin and ceramics having a thermal expansion coefficient of 2 ppm/&deg; C. or less, and that the thermal expansion coefficient is isotropic.

Substrate material for wiring and substrate material for printed circuit using the same

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Nagoya, Japan

Yoshitaka Tabuchi