Seiko Epson Corporation

Yoshitaka Sozawa

Toru Matsuyama

Hidekazu Uematsu

An image processing device includes a light receiving element, a light emitting element, a battery, a power source circuit electrically coupled to the battery, a first substrate provided with the light receiving element, a second substrate provided with the light emitting element, a third substrate provided with the power source circuit, and a casing storing the first substrate, the second substrate, and the third substrate, in which a portion of the battery facing the first substrate, the second substrate, and the third substrate has a smaller sectional area as the portion comes closer to the first substrate, the second substrate, and the third substrate.

Image processing device

An image processing device includes a light receiving element, a light emitting element, a battery, a power source circuit electrically coupled to the battery, a wireless communication module, a first substrate provided with the light receiving element, a second substrate provided with the light emitting element, a third substrate provided with the power source circuit, a fourth substrate provided with the wireless communication module, and a casing storing the first substrate, the second substrate, the third substrate, and the fourth substrate, in which the battery is located between the first substrate, the second substrate, and the third substrate, and the fourth substrate.

An image processing device includes a light receiving element, a light emitting element, and an operation section. The operation section and a region where the light emitting element is disposed are provided at a position where the operation section and the region overlap each other on an optical axis of the light receiving element.

An image processing device includes a first substrate, a second substrate, a third substrate provided with a power source circuit, and a casing storing the first substrate, the second substrate, and the third substrate, in which the first substrate has a first surface and a second surface, and is provided between the third substrate and the second substrate in a first direction orthogonal to the first surface, a light receiving element is provided on the second surface, the second substrate has a third surface, a fourth surface, and an opening, the third surface faces the second surface, and the opening is provided to overlap the light receiving element in the first direction, a light emitting element is provided on the fourth surface to surround the opening, and the power source circuit is provided on the third substrate not to overlap the light receiving element in the first direction.

Image processing device comprising a light receiving element on a second surface of a first substrate and plural light emitting elements on a fourth surface of a second substrate

An image processing device includes a light receiving element, a light emitting element, a battery, a power source circuit electrically coupled to the battery, an operation section, a wireless communication module, a first substrate provided with the light receiving element, a second substrate provided with the light emitting element, a third substrate provided with the power source circuit, a fourth substrate provided with the wireless communication module and the operation section, and a casing storing the first substrate, the second substrate, the third substrate, and the fourth substrate, in which the second substrate is fixed to the first substrate, and the first substrate is fixed to the casing.

An image processing device includes a light receiving element, a light emitting element, a battery, a power source circuit electrically coupled to the battery, an operation section, a first substrate provided with the light receiving element, a second substrate provided with the light emitting element, a third substrate provided with the power source circuit, a fourth substrate provided with the operation section, and a casing storing the first substrate, the second substrate, the third substrate, and the fourth substrate, in which the operation section and a region where the light emitting element is disposed are provided at a position where the operation section and the region overlap each other on an optical axis of the light receiving element.

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Nagano, Japan

Yoshitaka Sozawa