Mitsubishi Kinzoku Kabushiki Kaisha

Yoshitaka Shiratori

Tomoyoshi Sakamoto

Seiichi Abe

Hiroyuki Takahashi

An apparatus for collecting wafers sliced from a semiconductor crystal rod, and the apparatus includes a primary mobile member, a secondary mobile member and a wafer collecting assembly. The primary mobile member is movable toward and away the crystal rod, and the secondary mobile member is mounted on the primary mobile means and is movable relative to the primary mobile member in a direction toward and away from the semiconductor crystal rod. The wafer collecting assembly is mounted on the second mobile member for collecting the wafers sliced from the semiconductor crystal rod.

Apparatus for collecting wafers

A coolant supply nozzle apparatus for a slicing machine includes a body, a first mobile member, a second mobile member, a nozzle tube, a first positioner and a second positioner. The body has a pivot shaft disposed so as to extend axially of the blade. The first mobile member is pivotally mounted on the shaft. The second mobile member is mounted on the first mobile member so as to be movable in a direction parallel to the shaft. The nozzle tube is mounted on the second mobile member and has an opening end adapted to be directed toward the cutting edge of the shaft. The opening end is shifted from the pivot shaft radially of the blade. The first positioner serves to position the first mobile member in place while the second positioner serves to position the second mobile member in place.

Coolant supply nozzle apparatus for slicing machine

An apparatus for collecting wafers sliced from a semiconductor crystal rod, and the apparatus includes a primary mobile member, a secondary mobile member and a wafer collection assembly. The primary mobile member is movable toward and away from the crystal rod, and the secondary mobile member is mounted on the primary mobile member and is movable relative to the primary mobile member in a direction toward and away from the semiconductor crystal rod. The wafer collecting assembly is mounted on the second mobile member for collecting the wafers sliced from the semiconductor crystal rod.

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Tokyo, Japan

Yoshitaka Shiratori