Tokyo Electron Limited

Yoshitaka Otsuka

Yosuke Omori

Kenji Sugakawa

Takashi Nakamitsu

Osamu Hirakawa

Munehisa Kodama

Shinichi Shinozuka

Toshifumi Inamasu

Takashi Terada

Yuji Mimura

Hiroshi Maeda

Shigeto Tsuruta

Yutaka Yamasaki

Fumihiko Ikeda

Eiji Manabe

Hisanori Hizume

Kenya Shinozaki

Hironori Tanoue

A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.

Bonding system and inspection method of inspecting combined substrate

A bonding system includes a first holder and a second holder arranged to be spaced apart from each other in a vertical direction; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction between a first substrate held by the first holder and a second substrate held by the second holder; a pressing unit configured to press the first substrate and the second substrate against each other; a measuring unit configured to measure a position deviation between an alignment mark on the first substrate and an alignment mark on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; and a position adjustment controller configured to control the position adjustment in the horizontal direction in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing.

Bonding system

Bonding system and bonding method

A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.

Bonding apparatus and bonding method

There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

Bonding apparatus, bonding system, bonding method and storage medium

An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.

Foreign substance removal apparatus and foreign substance detection apparatus

A substrate processing apparatusincludes a first holding unitconfigured to hold a processing target substrate W; a second holding unitdisposed to face the first holding unitand configured to hold a support substrate S; and an ultraviolet irradiation unitconfigured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unitis made of an ultraviolet transmissive material. An electrodeconfigured to electrostatically attract the support substrate S is provided within the second holding unit. A diffusion layerconfigured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrodewithin the second holding unit

Substrate processing apparatus and manufacturing method of substrate holding unit

Jet lines C, C, C, . . . extending in an X-direction and suction lines C, C, C, . . . extending in the X-direction are arranged alternately at a fixed pitch W in a Y-direction. Jet openingsare arranged at fixed intervals 3D on the jet lines C, suction openingsare arranged at fixed intervals 3D on the suction lines C, and the jet openingsand the suction openingson the adjacent ones of the jet lines Cand the suction lines Care spaced apart from each other by a fixed distance D with respect to the X-direction. Slotsandare extended straight from the upper ends of the jet openingsand the upper ends of the suction openings, respectively, in a carrying direction (the X-direction) and a direction opposite the carrying direction.

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Koshi, Japan

Yoshitaka Otsuka