Ibiden Company Limited

Other

Yoshitaka Ono

Motoo Asai

Dongdong Wang

Kenichi Shimada

Kouta Noda

Yukihiko Toyoda

Koji Sekine

Masato Kawade

Hui Zhong

Youko Nishiwaki

Akihiko Goto

Ayao Niki

Taki Adachi

The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.

Multilayered printed circuit board

Multilayered printed circuit board, solder resist composition, and semiconductor device

This adhesive for electroless plating can be produced without causing dust explosion and is excellent as an interlaminar resin insulating layer and is obtained by mixing an organic solvent dispersion of cured particles of heat resistant resin soluble or decomposable in an acid or an oxidizing agent with an uncured resin. The dispersion of the cured particles of the heat resistant resin in the organic solvent is obtained by dispersing cured particles formed in the production of heat resistant resin cured particles into the organic solvent without drying, and the uncured resin is a resin becoming hardly soluble in an acid or an oxidizing agent through curing treatment and capable of forming a heat resistant cured resin.

Adhesive for electroless plating and method of producing the same

The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.

Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board

Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.

Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board

A solder resist composition comprises an acrylate of novolac type epoxy resin and an imidazole curing agent and has a viscosity of 0.5-10 Pa&middot;s adjusted with glycol ether type solvent. A printed circuit board is formed by using such a solder resist composition.

Solder resist composition and printed circuit boards

A resist composition for plating comprises a partial-acrylated, uncured novolac type epoxy resin as a photosensitive resin ingredient and an imidazole curing agent as a curing agent, wherein the imidazole curing agent is liquid at 25.degree. C. or the composition contains an acrylic ester polymer having a molecular weight of 500-5000. By using such a resist composition can be provided a printed wiring board having excellent conduction reliability and heat cycle property.

Growing community of inventors

Gifu, Japan

Yoshitaka Ono