Mitsubishi Electric Corporation

Yoshitaka Onishi

Satoshi Kawamura

Tomohiro Ueno

Junji Fujino

Masahiro Iezawa

Takayoshi Nagai

Sadayuki Matsumoto

Masafumi Sugawara

Yutaka Yoneda

Naoki Imamura

Takuya Yabumoto

Shinsuke Takeshima

A charging device for an electric vehicle includes a wireless power receiving device which receives high-frequency AC power in a non-contact state, a wired power receiving device connected to an external power source for low-frequency AC power, a rectifier which rectifies AC power, an electric power converter which is positioned at a rear part of the rectifier, and an power receiving device switching switch which switches electric power in such a way that any of electric power of both electric power receiving devices is outputted to the rectifier. A high-frequency filter, which removes a high-frequency component, is provided between the rectifier and the electric power converter.

Charging device for electric vehicle

If a bus current a bus current detectordetects exceeds a current cutoff value, an overcurrent detectorsupplies a gate driverwith an open signal for turning off switching elements-to break the current to a motor. Besides, when the overcurrent detectordetects an overcurrent, a feedback controllerprovides the gate driverwith a short-circuit braking instruction to apply short-circuit braking after breaking the power supply, and to restart PWM control from a state in which the short-circuit braking is being applied and the duty ratio command value is reset at 0.

Motor drive

An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer plate. An opening portion is provided in the vicinity of an electrode strip formed on the outer side of the printed wire board. An electric power semiconductor element is disposed between the heat transfer plate and the printed wire board, and adhered to the heat transfer plate. A wiring member has one end bonded to a first bonding portion of a main power electrode of the electric power semiconductor element, and the other end is bonded to a second bonding portion. At least part of the second bonding portion is included in a space that extends from the main power electrode to the printed wire board, and the first bonding portion is included in a space that extends from the opening portion.

Electric power semiconductor device

A brushless motor device switches between a 120-degree energization method and a 180-degree energization method of advancing an electrical angle by 30 degrees to drive a brushless motoraccording to the result of a comparison between the rotational speed of the brushless motorand a predetermined threshold.

Brushless motor device and control device

In opening/closing control for the valve mechanism to which the return torque is applied in an opening direction or a closing direction of the valve, provided are a position control system for outputting a q-axis current command based on a position deviation between a target position command directed to the brushless DC motor and the coarse present position of the motor obtained by using the position detection sensor of a pulse output type, and a current control system in which a virtual current feedback is built for outputting a phase voltage command without a current sensor based on the q-axis current command and the coarse present position of the motor obtained by using the position detection sensor of the pulse output type.

Growing community of inventors

Tokyo, Japan

Yoshitaka Onishi