Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Yoshitaka Ochiai

Keiichi Mashino

Hiromichi Anan

Atsuhiro Yoshizaki

Toshiyuki Innami

Shinichi Fujino

Akira Mishima

Shinji Shirakawa

One method of achieving the above subjects is by connecting a block member, which is connected to the side opposite to that of a semiconductor chiphaving insulating substratesandconnected to the top and bottom of the semiconductor chip, to a block memberacross an laminated structure constituted by the semiconductor chipand the insulating substratesand

Semiconductor module and power conversion device

The present invention provides a semiconductor device which reduces an inductance of wiring for bridge-connecting semiconductor switches and realizes a reduction in size. Within the semiconductor device formed are two controllable bridge-connected semiconductor switchesand, an output terminal, positive/negative polarity DC terminalsand, and an insulating substratein which conductor layersandhaving a conductor section and in an inner layer for bridge-connecting the semiconductor switches to the DC terminals on a surface thereof and insulating layersandare alternately laminated. The surface and inner-layer conductor layersandwhich interpose the insulating layertherebetween are electrically connected by a conductorpassing through the insulating layerinterposed between the conductor layersand. A current path (dotted line) is so provided as to allow current flowing through a bridge circuit for mounting the two semiconductor switches on the insulating substrate to flow in opposite directions between the conductor layersandwhich interpose the insulating layertherebetween.

Semiconductor device having bridge-connected wiring structure

One method of achieving the above subjects is by connecting one of electroconductive members, which are pre-connected to the top and bottom of a semiconductor chipand have thermal conductivity, to an electroconductive member, which is used with the semiconductor chipto constitute a laminated structure, in electrically insulated form on the same surface as the installation surface of the electroconductive memberso as to straddle the laminated structure constituted by the semiconductor chipand the electroconductive member

A positive side conductor and a negative side conductor of an input terminal electrically connected to semiconductor elements, are electrically insulated from each other, and are laminated with each other, and the input terminal having such a laminated structure, an output terminal and substrates mounted thereon the semiconductor elements are arranged in a checkered pattern in a container. Further, the semiconductor elements mounted on the substrates, the input terminal and the output terminal are electrically connected to one another so as to obtain a loop-like electric path on a conductive member, thereby it is possible to aim at miniaturizing the power conversion apparatus and lowering the inductance thereof.

Growing community of inventors

Hitachi, Japan

Yoshitaka Ochiai