Sanyo Electric Co., Ltd.

Mitsuboshi Diamond Industrial Co., Ltd.

Toyo Aluminium Kabushiki Kaisha

Kwansei Gakuin Educational Foundation

Toyota Tsusho Corporation

Yoshitaka Nishio

Yuji Hamada

Takanori Fujii

Kenichi Shibata

Takeshi Sano

Masayuki Fujita

Kazuhiko Kuroki

Hiroshi Kanno

Tadaaki Kaneko

Daichi Dojima

Masakazu Sakata

Moeko Matsubara

Toshiyuki Sakai

Haruo Wakayama

Hisakazu Takahashi

Junichi Matsumoto

Yoshikazu Tsujino

Yukio Oshima

Hiroshi Matsuki

Keiko Hayashi

Yukinori Kuwano

Hiroyuki Fujii

Tatsuro Usuki

Kazuhiro Yoshimoto

Akira Ejimatani

Masao Yamamoto

Yasutomo Okajima

Atsushi Tabata

Junichi Sano

Hiroyuki Ohnari

Sotaro Akiyama

An object of the present invention is to provide a novel technique capable of manufacturing a large-diameter AlN substrate. The present invention is a method for manufacturing an AlN substrate, including a crystal growth step Sof forming an AlN layeron a SiC underlying substratehaving through holes. In addition, the present invention is a method for forming an AlN layer including the through hole formation step Sof forming the through holesin the SiC underlying substratebefore forming the AlN layeron the SiC underlying substrate

Method for manufacturing aluminum nitride substrate, aluminum nitride substrate, and method for forming aluminum nitride layer

The purpose of the present is to provide a modified AlN source for suppressing downfall defects. This manufacturing method of a modified aluminum nitride source involves a heat treatment step for heat treating an aluminum nitride source and generating an aluminum nitride sintered body.

Manufacturing method of modified aluminum nitride raw material, modified aluminum nitride raw material, manufacturing method of aluminum nitride crystals, and downfall defect prevention method

The problem to be solved by the present invention is to provide a novel technique that can remove a strained layer introduced into an aluminum nitride substrate. In order to solve this problem, the present aluminum nitride substrate manufacturing method involves a strained layer removal step for removing a strained layer in an aluminum nitride substrate by heat treatment of the aluminum nitride substrate in a nitrogen atmosphere. In this way, the present invention can remove a strained layer that has been introduced into an aluminum nitride substrate.

Aluminum nitride substrate manufacturing method, aluminum nitride substrate, and method of removing strain layer introduced into aluminum nitride substrate by laser processing

An aluminum foil having a high adhesiveness to solder and containing at least one of Sn and Bi, in which a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil is 0.0075 mass % or more and 15 mass % or less.

Aluminum foil, electronic component wiring board manufactured using the same, and method of manufacturing aluminum foil

A scribing line forming mechanism according to the present invention includes: a scribing line forming means () being structured so as to form a scribing line on a substrate by contacting the substrate; and a supporting means for supporting the scribing line forming means such that the scribing line forming means is turnable about a first turning axis (), the supporting means being structured so as to be turnable about a second turning axis (), the second turning axis being different from the first turning axis, wherein the axial center of the first turning axis and the axial center of the second turning axis are approximately in parallel, and the axial center of the second turning axis is distant by a predetermined interval from a portion where the substrate and the scribing line forming means contact each other.

Scribe line forming mechanism, scribe head, and scribe device

In a method for removing deposit that has attached to a main surface of a substrate from the main surface of the substrate using air knife units where a slit portion is formed so that a fluid can be discharged in band form, a fluid introduction path having an approximately uniform form in the direction perpendicular to the direction in which a number of air knife units move relative to the substrate is formed between the air knife units and the main surface of the substrate while the air knife units move relative to the substrate, a fluid is discharged toward the fluid introduction path from a slit that is formed in the rear portion of the above described air knife units, and then, passes through the fluid introduction path so as to be led to a wall surface that is formed so as to face the front portion of the air knife units or the fluid which has the appearance of a wall surface, and furthermore, deposit on the substrate that has attached to the substrate is led away from the main surface of the substrate, together with said fluid, via a fluid lead-out path of which the cross sectional area of the low path is greater than that of the fluid introduction path, and which is formed between the air knife units and the wall surface.

Method for removing deposit from substrate and method for drying substrate, as well as apparatus for removing deposit from substrate and apparatus for drying substrate using these methods

A scribing headof this invention raises and lowers a scribing cutter by rotation of a servomotorAs a scribe pressure, a rotational torque of the servomotoris transmitted to the scribing cutter. To form a scribe line across another scribe line which is formed earlier, the scribe pressure is raised temporarily when the scribing head passes the scribe line which is formed earlier. The rotational torque of the servomotoris controlled at any of preset limits while the position of a cutterof the scribing head shifts on the brittle substrate. The servomotoris driven under position-control mode.

Scribing head, and scribing apparatus and scribing method using the scribing head

A substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate is disclosed. A pair of substrate cutting devices are provided in a cutting device guide bodyso as to be movable along a direction perpendicular to the moving direction of the clamp devices, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices

Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method

Vertical cracks Vm in the thickness direction of a mother glass substrate 10 are sequentially formed along lines to be scribed and broken, and thus main scribe lines MS are formed along the lines to be scribed and broken of the mother glass substrate 10. Then, subordinate scribe lines SS are formed along the main scribe lines MS which have been formed, at a predetermined distance from the main scribe lines MS. Thus, the mother glass substrate 10 is broken along the main scribe lines MS. In this manner, the substrate can be scribed and broken efficiently without requiring a complicated device or the like.

Method for dividing substrate and method for manufacturing substrate using such method

A scribing head according to the present invention includes: a scribing line forming means () structured so as to form a scribing line on a substrate; and a moving means () for moving the scribing line forming means such that the scribing line forming means presses the substrate with a constant magnitude, wherein the moving means includes: a rotation means () rotating about a rotation axis, the axial center of the rotation axis being provided so as to align with a predetermined direction in which the scribing line forming means moves, and a motive power transmission means () for transmitting a motive power between the motive power transmission means and the scribing line forming means such that the scribing line forming means moves on a straight line along the axial center of the rotation axis in response to the rotation of the rotation means, the motive power transmission means being provided along the predetermined direction.

Scribe head and scribe device

A vacuum suction head of the present invention can be applied to a large-sized liquid crystal display panel and can reliably suck an object to be sucked even if the object has undulation or flexure. The suction head has a shaft, which holds a suction pad, and gas is charged into and discharged from the suction pad through a suction hole. A casing holds the shaft through first and second springs so as to be movable in the axial direction. Since the suction pad is elastically supported by the springs, the suction pad can reliably suck the object to be sucked having undulation or flexure. The vacuum suction head can be used for a vacuum suction device and a working table.

Vacuum suction head, and vacuum suction device and table using the same

The light emitting layers and the electron transporting layers of R pixels, G pixels, and B pixels are formed to have a stripe shape extending in the column direction. The red light emitting layer and the electron transporting layer in R pixels are formed to be continuous layers using the same mask in a first vapor deposition chamber, the green light emitting layer and the electron transporting layer of G pixels are formed to be continuous layers using the same mask in a second vapor deposition chamber, and the blue-white light emitting layer and the electron transporting layer of B pixels are formed to be continuous layers using the same mask in a third vapor deposition chamber.

Organic electroluminescent display apparatus and method of fabricating the same

An organic EL device is fabricated by a novel method to reduce the occurrence of poor luminescence in the organic EL device. An anode layer, a hole transporting layer, a luminescent layer, an electron transporting layer, and a cathode layer are laminated in this order on a substrate to form an organic EL device. In the organic EL device, the hole transporting layer is increased in thickness so that foreign particles adhering on the anode layer are substantially covered with the hole transporting layer.

Method of manufacturing an organic electroluminescent device and resulting device

A plurality of lower data electrodes provided on a transparent substrate are covered with an insulating layer. A plurality of upper data electrodes are arranged on the insulating layer. An organic thin film including an organic emission layer is formed on the upper data electrodes, and a plurality of scan electrodes are formed on the organic thin film to be perpendicular to the lower data electrodes. The plurality of lower data electrodes are divided into a plurality of groups. A plurality of upper data electrodes located above the lower data electrodes of each group are connected to the lower data electrodes of each group through openings of the insulating layer. The width of the scan electrodes is set to cover upper portions of the plurality of upper data electrodes arranged on the lower data electrodes of each group.

Growing community of inventors

Osaka, Japan

Yoshitaka Nishio