Fujitsu Corporation

Yoshitaka Muraoka

Masayuki Kitajima

Masakazu Takesue

Yutaka Noda

Kazuo Sato

Shigeo Iriguchi

Hidehiko Fuchida

Shuko Saito

Tomohiko Maeda

Satoshi Watanabe

Hiroshi Amano

Nobuo Taketomi

Kiyoyuki Hatanaka

Fumihiko Tokura

In an RFID system comprising a detection unit for detecting an RFID tag and a control unit for exercising the control concerning the RFID tag, a determination unit determines whether to access a second area of an RFID tag comprising storage area, comprising of a first area for storing ID information and the second area for storing command information. An extraction unit extracts command information from the second area when it is determined to access the second area. An execution unit performs a process corresponding to the command information extracted by the extraction unit.

RFID system and RFID tag

In a mechanism for attaching to a cart an RFID tag used for transmitting and receiving data to and from an RFID reader/writer, a holding pocket retains the RFID tag. The orientation of the pocket is kept constant in such a manner that a surface of the RFID tag from which data can be read highly accurately faces an antenna for the RFID reader/writer while keeping the distance between the RFID tag and the antenna within a certain range regardless of the transfer direction of the cart.

Mechanism for attaching RFID tag, transfer device and transfer system using RFID tag

A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.

Electronic apparatus

A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Semiconductor device with gold bumps, and method and apparatus of producing the same

A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

At one end of a printed wiring board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. At one end of an FPC which is to be connected with the printed circuit board, there is formed a narrow-pitched electrode pattern and engagement patterns made of the same material as that of the electrode pattern. The engagement patterns in the printed wiring board being engageable with the engagement patterns in the FPC. When the two engagement patterns are engaged with each other, the electrode pattern of the printed wiring board is electrically connected with the electrode pattern of the FPC.

Method of connecting printed wiring boards with each other, and printed circuit board

A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.

Method of forming bumps and template used for forming bumps

A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.

Growing community of inventors

Kawasaki, Japan

Yoshitaka Muraoka